Wafer Dicing Saw

HY-WD681 provides micron-precision cutting for 6/8-inch wafers, ceramic and glass substrates. Built with auto CCD vision alignment and high-speed adjustable spindle, it saves cleanroom space while boosting production stability and throughput, ideal for semiconductor mid-process singulation & Mini LED manufacturing.

HY-WD1201 accommodates max Φ300mm workpieces with 310mm X/Y travel for 8–12 inch frames. Equipped with rigid anti-vibration structure, 0.003mm Y-axis positioning accuracy and 380° θ-axis rotation, it carries a 10000–60000rpm spindle compatible with Φ58mm blades. Standard with blade inspection, auto sharpening, 15-inch touch control and GEM communication, this 115010201750mm/1000KG machine realizes precision cutting for silicon wafers, SiC, ceramics, optical glass and magnetic materials.

HY-PD1202 fits large 300×300mm frames. Full closed-loop Y control keeps 0.005mm accuracy across 310mm travel, Z repeat precision stays 0.003mm. Equipped with non-contact height detection, dual-light vision, blade inspection and heavy-duty spindles. Optimized spindle layout and large square tray raise efficiency by 5%; centralized lubrication ensures long-term precision, fully GEM-compatible for mass-production automation lines.

HY-WD601 is designed for 6-inch semiconductor and hard brittle workpieces. Fitted with an imported high-speed spindle and Y-axis grating closed-loop control, it delivers ultra-precise cutting performance. Equipped with coaxial & ring light vision, NCS height measurement and BBD blade detection, it meets multi-material precision cutting demands across semiconductor packaging, optoelectronics and new energy industries. It features touchscreen operation, full safety protection and multiple intelligent cutting modes.