aluminum wedge bonding

The HY-WB900 Deep Access Wedge Wire Bonder is designed for chip-to-pin interconnection in advanced electronic component packaging. It supports hybrid circuits, COB, MCM, MEMS, RF, optoelectronic and automotive modules, featuring real-time bonding deformation monitoring, ultrasonic energy feedback, precise loop control and consistent tail wire management.

HY-HW3850 Automatic Ultrasonic Heavy Aluminum Wire Wedge Bonder is designed for high-efficiency wire bonding of power semiconductor packages such as TO-220, TO-247, TO-252, TO-251 and TO-263. Featuring dual bonding heads, PR visual positioning and automatic loading and unloading, it supports aluminum wire diameters from 125 to 500 μm, delivering accurate, stable and consistent bonding for mass production.

HY-HW3200 Ultrasonic Heavy Aluminum Wire Wedge Bonder is designed for internal wire bonding of power semiconductor devices such as MOSFETs, high-power transistors, diodes, thyristors and power modules. It features precise motion control, adjustable bonding parameters, stable ultrasonic output and support for 1–6 bonding points, ensuring reliable bonding quality and efficient operation.

HY-HW3018 Ultrasonic Heavy Wire Bonder is used for internal lead bonding of medium- and high-power transistors, MOSFETs, various power modules, high-current fast recovery diodes, Schottky diodes, thyristors, IGBTs, and other special semiconductor power devices.