Ultrasonic Heavy Aluminum Wire Wedge Bonder

Product Introduction

HY-HW3200 Ultrasonic Heavy Aluminum Wire Wedge Bonder is designed for internal wire bonding of power semiconductor devices, including MOSFETs, transistors, diodes, thyristors and power modules. Its precision stepper motor system ensures accurate and high-speed bonding head movement, while key parameters can be easily adjusted and monitored through the LCD control panel.

With automatic bonding force control, stable ultrasonic output and support for 1–6 bonding points, the machine delivers reliable bonding quality and helps reduce contact resistance. Parameter storage for up to four wires further improves setup efficiency and production consistency.

Applications

Features

No.	Feature	Description
1	Precise Motion System	Y- and Z-axis movements of the bonding head are driven by microcontroller-controlled stepper motors with precision guide rails, ensuring flexible motion, accurate positioning and high speed.
2	User-Friendly Parameter Control	Parameters including ultrasonic power, time, bonding force, loop shape, second bond tail wire, target height, span, cutter force and illumination can be easily adjusted via panel buttons/knobs with real-time LCD display.
3	Stable & Reliable Bonding	Bonding force is automatically controlled, and the powerful ultrasonic system ensures stable and reliable welding quality.
4	Multi-Bonding Capability	Supports 1 to 6 bonding points on the same plane, greatly reducing contact resistance and improving reliability for large-area power devices.
5	Parameter Memory Function	Can store parameters such as span, loop shape and target positions for up to four wires, effectively improving operation efficiency.