Automatic Ultrasonic Heavy Aluminum Wire Wedge Bonding Machine

Product Introduction

HY-HW3850 Automatic Ultrasonic Heavy Aluminum Wire Wedge Bonder is designed for single-row and multi-row power semiconductor packages, including TO-220, TO-3P, TO-247, TO-252, TO-251, TO-263 and similar products.

Its dual bonding heads use precision linear motor drives and can rotate automatically for bonding at different angles. Advanced PR image recognition, digital ultrasonic control and constant pressure control ensure accurate positioning and consistent bonding quality. The two bonding heads can also process different wire diameters simultaneously, supporting aluminum wires from 125 to 500 μm.

Equipped with automatic loading and unloading, wire-feeding monitoring and fault alarm functions, the machine supports continuous production with reduced manual intervention. For TO-220 double-wire bonding, the production capacity can reach approximately 2.2–2.7K units per hour, making it suitable for efficient mass production of power semiconductor devices.

Applications

Features

No.	Item	Description
1	Ultra-Precise Bonding	Adopts the same image recognition software as gold wire bonders, with automatic image recovery for chips with uneven grayscale. Multiple templates are calibrated one by one to ensure higher bonding accuracy.
2	International Standard Bonding Quality	Wire bonding performance is equivalent to imported equipment. Bonding parameters, loop height and span are digitally adjustable, ensuring stable and consistent bonding points.
3	Industry Leading Bonding Speed	Bonding speed ranks top in China. For 125 μm aluminum wire, it can achieve 2.5–3.0K double wires per hour, greatly improving work efficiency.
4	Automatic Loading & Unloading System	Equipped with a patented automatic loading/unloading system that can hold 4 material boxes at the same time. One operator can manage 4–5 machines, realizing fully automatic mass production.
5	Servo Motor Driven	Adopts servo motors to improve overall stability and production capacity.
6	Chinese Operation Interface	Simple Chinese operation menu makes operation and training easier.
7	Precision Imported Fiber Optic Sensor	Real-time monitors wire feeding and bonding quality, effectively detecting poor bonding and wire non-stick issues.
8	Easy Consumables Matching	Consumables are directly compatible with those used in OE machines.
9	Wire Clamp Function	The built-in wire clamp enables arc formation at dual bonding points on the chip.

 

It adopts advanced image recognition and automatic positioning technology to realize automatic and accurate bonding point positioning, where each point can be individually set for multi-bond products. The powerful digital ultrasonic system with automatic frequency tracking and optimized bonding head design ensures stable and reliable bonding quality. The proprietary digital pressure control system maintains constant pressure output to ensure bonding consistency. The loading and unloading mechanism is equipped with multiple electronic sensors and contact control for reliable operation, while the well-designed fixture and unique feeding method guarantee welding quality and greatly improve efficiency. Precision mechanical transmission, reliable industrial PC, and proprietary software ensure high bonding positioning accuracy. Fault alarm and shutdown functions for first bond failure, abnormal wire feeding, and other issues effectively reduce the defect rate and increase productivity. The user-friendly design allows new operators to master the operation quickly, and one person can operate multiple machines at the same time to further enhance work efficiency.