molding mold

HY-PM-TO252 Semiconductor Molding Mold is designed for post-process encapsulation of integrated circuits, semiconductor devices, optoelectronic components, optocouplers and sensors. It supports a wide range of package types and features a drawer-type quick-change mold box, balanced runner design and short-distance molding for high resin utilization, stable molding quality and easy maintenance.

 HY-PMS03 MGP molding mold fits SMA, SMB, SMC surface mount diodes and works with 400T+ molding presses. Each package has 4 mold boxes to form 8 lead frames at once. With quick swap mold boxes and chrome-coated wear-resistant alloy cavities, it reaches 200,000 shots. Plastic offset ≤0.05mm avoids overflow, bubbles and voids for steady mass production.

HY-MF300 is auxiliary equipment for plastic packaging molds, capable of one-time removing runner and gate residual flash for all IC packages. Equipped with Mitsubishi/Yonghong PLC control and full safety interlocks including light curtain, door sensor, E-stop and two-hand buttons, it delivers stable performance and universal compatibility for all semiconductor packaging production lines.

HY-PM252-6R Molding is a high-precision molding mold designed for TO252-6R package products. The mold features a universal mold base capable of accommodating 6 mold boxes with quick mold box change design, utilizing a bottom-to-top multi-pot injection design driven by four built-in high-temperature-resistant, leak-proof hydraulic cylinders with a balanced injection head drive plate.