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HY-MF300 is auxiliary equipment for plastic packaging molds, capable of one-time removing runner and gate residual flash for all IC packages. Equipped with Mitsubishi/Yonghong PLC control and full safety interlocks including light curtain, door sensor, E-stop and two-hand buttons, it delivers stable performance and universal compatibility for all semiconductor packaging production lines.
Brand :
HYRNUSItem No. :
HY-MF300Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaSemiconductor Molding Runner Flash Removal Punch Machine for All IC Packages
Product Introduction
HY-MF300 Semiconductor Molding Runner Flash Removal Punch Machine is dedicated auxiliary equipment matched with semiconductor plastic molding molds. It can complete one-time removal of molding runner burrs and gate residual plastic after encapsulation, compatible with all types of IC packaging.
Traditional manual flash cleaning is slow and inconsistent; this automatic punch machine replaces manual work, significantly improving post-molding processing efficiency, lowering labor expenses and unifying product finishing quality.
Product Application
One-time removal of runner and gate residual flash after plastic molding
Product Features
1. Special auxiliary machine for semiconductor molding molds, one-step removal of runner and gate residual flash after plastic encapsulation
2. Wide compatibility, supports all types of IC packaging products
3. Adopts Mitsubishi or Yonghong PLC control system with physical operation buttons for easy adjustment
4. Multi-layer safety interlock design: light curtain sensor, door open protection, emergency stop button, two-hand synchronous linkage buttons to avoid operation injuries
Product Details
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