High-Precision Molding Mold for TO252-6R

HY-PM252-6R Encapsulation Mold are fully interchangeable on the mold base without position-specific identification. Key materials include DC53 mold boxes (hardness HRC59–60), ASP23 cavities, inserts, and center blocks (hardness HRC61–63), ASP23 injection barrels, and tungsten carbide injection heads. The leadframe loading plate is made of high-strength aluminum alloy with a floating support design. The mold accepts a maximum of 100,000 shots or 1 year of use, with acceptance standards covering external dimensions (L×W×T), roughness, draft angles, and cavity surface quality. Quality requirements include misalignment ≤0.05mm in any direction, flash control with no impact on downstream automatic handling, mold compound leads with flash controlled within 1.0mm, and void/pinhole size <0.1mm on mold compound surface. Internal defects such as voids above chip/lead bond areas are not allowed, while voids elsewhere must be ≤0.1mm. The mold operates at 160–180°C mold temperature with injection pressure of 1000–1600 psi and injection time of 8–25 seconds. The cavity coating supports 150k shots (green pellet) or 200k shots (standard pellet) without peeling.

Quality Requirements for Molded Products

Item	Acceptance Standard	Standard after 100,000 shots or 1 year
External dimensions: L × W × T	Per molded product drawing	-
Top length, top width, top thickness	Per molded product drawing	-
Bottom length, bottom width, bottom thickness	Per molded product drawing	-
Lead thickness	Per molded product drawing	-
External features
Roughness Ra	Per molded product drawing	-
Top draft angle	Per molded product drawing	-
Bottom draft angle	Per molded product drawing	-
Cavity	Chrome-plated surface	-
Misalignment (X, Y direction)
Any direction offset of top/bottom mold compound	≤0.05	-
Any direction offset between mold compound center and leadframe center	≤0.05	-
Flash at one end of runner/vent groove	No impact on automatic handling in downstream processes	No impact on automatic handling in downstream processes
Residual film-like flash thickness at vent end of mold compound	No impact on automatic handling in downstream processes	No impact on automatic handling in downstream processes
Residual waste material at gate end after separation, extending outward from root	No impact on automatic handling in downstream processes	No impact on automatic handling in downstream processes
Upward protrusion of residual waste material at gate end after separation, starting from the dam bar	None	None
Mold compound leads	No flash allowed on lead surface; if transparent flash exists, it must be controlled within 1.0 mm	-
Mold release performance	Good mold release; no breakage of ejected runner or cull	Good mold release; no breakage of ejected runner or cull
Molding parameters (during acceptance)
Mold temperature	160–180°C	-
Injection pressure on material	1000–1600 psi	-
Injection time	8–25 sec	-
Surface defects
Cavity scratches/marks (as seen on product surface)	None	-
Wavy marks on cavity surface (as seen on product surface)	None	-
Void size on mold compound surface	<0.1	-
Pinhole size on mold compound surface	<0.1	-
Cracks or chipping on mold compound surface	None	-
Chimney-like flash thickness/height on top edge of ejector pin	None	-
Vertical thin-edge flash thickness/height at insert joint surface	≤0.05	≤0.05
Center residual pellet flash overflow thickness/width	≤0.05	<0.05, <2
Flash overflow thickness/width on both sides of runner	≤0.05	<0.05, <1
Leadframe deformation or pilot hole tear after mold opening/ejection	Not allowed	Not allowed
Internal defects
Void size above chip/lead bond area and below paddle	None	-
Number of voids above chip/lead bond area and below paddle	None	-
Delamination size above chip/lead bond area and below paddle	Not allowed	-
Void size elsewhere in mold compound	≤0.1 mm	-
Non-fill	Not allowed	-
Cavity coating	150k shots (green pellet), 200k shots (standard pellet); no coating peeling (shot count preferred)	-

Mold Configuration

Item	Standard
Mold Body	The mold must be compatible for use on the buyer's press of 550 tons or above.
	Universal mold base capable of accommodating 6 mold boxes, with quick mold box change design.
	Injection type: bottom-to-top multi-pot injection design. Injection action is driven by four built-in high-temperature-resistant, leak-proof hydraulic cylinders, with a balanced injection head drive plate.
	Each mold box is fully interchangeable on the mold base without the need to identify specific positions.
	Components within each mold box are fully interchangeable; various inserts can be mutually replaced.
	Mold box design includes a built-in ejector pin plate mechanical structure connected to the ejector drive device inside the mold base, as well as rail-type extraction and insertion design for quick mold box change.
	Mold box and its main components shall be made of materials meeting or exceeding the following requirements:
	- Mold box: DC53 (hardness: HRC59–60)
	- Cavities and inserts: ASP23 (hardness: HRC61–63)
	- Center block: ASP23 (hardness: HRC61–63)
	- Injection barrel: ASP23
	- Injection head: Tungsten carbide
	Leadframe loading plate shall be made of high-strength aluminum alloy, offering light weight and resistance to deformation. Leadframe support adopts a floating design to ensure smooth and interference-free loading.
	Cavity surface roughness must meet the requirements of the molded product outline drawing.
	Both upper and lower mold bases are designed with thermocouple holes next to each heater rod hole, compatible with 24-zone temperature control molding presses that independently control each heater rod. Each mold base has four thermocouple holes at the rear, compatible with molding presses featuring two-zone or four-zone temperature measurement.
	Both upper and lower mold bases are designed with holes for overtemperature cut-off sensor switches, compatible with those equipped on the molding press.
	The bottom plate of the lower mold base is designed with an air flotation function for easy mold installation.
	The clamping method for upper and lower mold bases adopts an L-shaped clamp plate design to suit different press platens.
	All screws and nuts inside the mold shall be designed based on the metric system.
	The connector fixing base and the injection head drive plate adopt a quick rail-type insertion, extraction, and locking design.
	Heater rod power must be selected to ensure that the temperature difference between upper and lower mold surfaces is within ±5°C.
	The root of each heater rod must be clearly marked with its power rating.
	A heater rod fixing device must be provided around each heater rod hole on the mold.
Insulation Jacket	Upper mold: fixed insulation jacket; lower mold: quick-detachable insulation plates on both sides.
Insulation Plate	All insulation plates on the mold must withstand prolonged clamping pressure without deformation and must not cause any issues on the mold surface.
Heater Rods	Must be marked with power rating and operating voltage.
Thermocouple Interface	Must match the buyer's molding press, supporting 2-zone, 4-zone, and 24-zone temperature control.
Thermal Protection Interface	Must match the buyer's molding press.
Clamp Plate Structure	Must match the buyer's molding press.
Upper and Lower Mold Plate Thickness	Thickness must be greater than 40 mm.
Clamp Plate to Mold Plate Fastening Method	Clamp plate must be tightly pressed against the mold plate.
Clamp Plate Screws	Must match the buyer's molding press.
Press Ejector Pin Layout	Ejector pin positions to be selected based on mold condition.
Press Platen Dimensions	To be provided by the buyer.
Mold Air Flotation Interface
Oil Pipe Interface	Must match the press oil pipe connector.
Mold Cavity Layout Drawing	Refer to molded product drawing.
Total Mold Thickness	Total mold thickness after clamping must be greater than 520 mm, according to current mold design.

Product Details