Plasma Cleaning Equipment

HY-EL25H is a laboratory plasma treatment system widely adopted by research institutes, corporate R&D departments and small-batch pilot production lines. It adopts CCP (Capacitively Coupled Plasma) discharge technology. The complete system consists of a square stainless steel vacuum chamber, plasma generator, vacuum pump and gas inlet & exhaust ports. It effectively enhances substrate surface adhesion and improves surface hydrophilicity, with extensive applications in material bonding, coating, substrate film deposition and wafer bonding. This equipment delivers stable, repeatable plasma treatment for semiconductor, microfluidic and new material research projects.

HY-PS13 is a CCP vacuum plasma system dedicated to wafer photoresist stripping, cleaning and surface activation. Popular in research labs and small-batch semiconductor production, its stainless steel chamber full set with pump & gas modules improves material surface adhesion and hydrophilicity for bonding, coating and thin-film processes.

HY-ES10 is an experimental plasma treatment system, widely adopted by research institutes, universities, corporate R&D labs and low-volume production lines. It adopts CCP (Capacitively Coupled Plasma) discharge technology. The complete system consists of a vacuum chamber, plasma generator, vacuum pump, and gas inlet & exhaust ports. The treatment chamber is fabricated from square stainless steel.

HY-AD800 safely processes delicate chips, PCBs and plastic components without thermal deformation. Equipped with 0–800W adjustable power, IO/manual dual operation and complete safety protection, it can be easily integrated into automated production lines for surface cleaning, activation and improved bonding, making it ideal for semiconductor packaging, 3C electronics, automotive, new energy and LED manufacturing.