What Are You Looking For?
HY-ES10 is an experimental plasma treatment system, widely adopted by research institutes, universities, corporate R&D labs and low-volume production lines. It adopts CCP (Capacitively Coupled Plasma) discharge technology. The complete system consists of a vacuum chamber, plasma generator, vacuum pump, and gas inlet & exhaust ports. The treatment chamber is fabricated from square stainless steel.
Brand :
HYRNUSItem No. :
HY-ES10Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
China0–300W Continuously Adjustable Compact Vacuum Plasma Cleaning Machine for Laboratory R&D
Product Introduction
HY-ES10 is a 0–300W Continuously Adjustable Compact Vacuum Plasma Cleaning Machine engineered for universities, research institutes, corporate R&D labs and small-batch prototyping applications. Adopting mature and reliable CCP (Capacitively Coupled Plasma) generation technology, the unit features an all-in-one integrated design consisting of a vacuum reaction chamber, plasma generator, vacuum pumping unit, multi-channel precision gas circuit and intelligent PLC control system.
With low-temperature plasma technology, the machine carries out various processes including surface cleaning, activation, micro-etching, wafer bonding and photoresist ashing. It significantly enhances material surface adhesion and modifies hydrophilic or hydrophobic properties, serving as universal pre-processing equipment for material bonding, coating and substrate film deposition processes.
Product Application
1. Cleaning: Removal of organics, oxides, metal salts, nano-scale particulate contaminants, etc.
2. Activation: Hydrophilic/hydrophobic modification, surface energy improvement, functional group grafting, biocompatibility optimization, etc.
3. Etching: Surface patterning, micro-etching, surface morphology & roughness adjustment, etc.
4. Bonding: Bonding of microfluidic devices such as PDMS chips.
5. Photoresist Stripping: Photoresist ashing, bottom anti-reflective coating (BARC) removal, etc.
Product Features
1. Stainless steel vacuum chamber with military-grade welding process, featuring excellent tightness and outstanding corrosion resistance.
2. Equipped with 2 built-in electrodes and multi-layer processing trays to maximize space utilization.
3. Intuitive touchscreen HMI for user-friendly operation, which displays real-time process parameters.
4. Supports storage of multiple process recipes for one-click recall, enabling full data traceability.
5. Two independent gas channels are configured to facilitate research on how different gas ratios affect cleaning results.
6. Convection-type gas distribution system forms dynamic gas circulation during operation with uniform air intake to deliver superior cleaning performance.
Machine Outline Drawing and Vacuum Chamber Diagram
Technical Specifications
| No. | Category | Item Name | Parameters |
| 1 | Plasma Generator | Power | 0–300W, continuously adjustable |
| Frequency | 40 KHz | ||
| 2 | Vacuum Reaction Chamber | Chamber Material | Imported 316 stainless steel with military-grade sealing |
| Chamber Volume | 10.8 L | ||
| Chamber Dimension | 200(W) × 270(D) × 200(H) mm | ||
| Single-Layer Effective Processing Area | 176(W) × 210(D) mm | ||
| Electrode Quantity | 2 gold-plated aluminum alloy dedicated electrodes | ||
| Processing Layers | 3 layers | ||
| Single-Layer Height Spacing | H: 35 mm | ||
| 3 | Gas Control System | Gas Flow Controller | 500 SCCM |
| Gas Channel Quantity | 2 independent channels, compatible with O₂, Ar, N₂, H₂, etc. | ||
| (Notify us in advance if corrosive gas is required) | |||
| 4 | Vacuum Measurement | Vacuum Measuring System | Measuring Range: 5×10⁻² ~ 1.0×10⁵ Pa |
| Measurement Accuracy: 0.1 Pa | |||
| 5 | Pumping System | Vacuum Pump | Pumping Speed: 16 m³/H |
| Vacuum Pipeline | Stainless steel pipeline + pneumatic valves | ||
| 6 | Control System | Touch Screen | 7-inch |
| Control Mode | PLC | ||
| Real-Time Monitoring | Power, working duration | ||
| Software Program | Self-developed patented plasma control system, auto/manual mode, IO monitoring | ||
| Alarm Function | Vacuum anti-misoperation protection | ||
| Pressure Balancing Function | Supports process gas inlet with adjustable pre-balancing time | ||
| 7 | Utility Requirements | Power Supply | 220V 50/60Hz 9A |
| Gas Pipe Interface | Diameter: 6 mm | ||
| Gas Purity | 99.99% | ||
| Gas Pressure | 0.4–0.6 MPa | ||
| Exhaust Port | KF25 |
Operating Environment (Items to be Prepared by Customer)
| No. | Category | Requirements |
| 1 | Power Supply | Input grid: 220V, 50/60Hz, voltage fluctuation ±10%; the ground wire must meet international standards; no strong electromagnetic interference around the installation position. |
| 2 | Installation Condition | Ambient temperature: 0–40°C; Ambient relative humidity: 15%–60%. |
| 3 | Gas Supply | Gas cylinders for O₂, Ar, N₂, H₂ etc. (must be equipped with pressure regulator); inlet pressure ＞0.3MPa; gas pipe connector size: Φ6mm. |
| 4 | Exhaust Pipeline | Connect to the exhaust port of vacuum pump (mandatory if installed in clean / dust-free rooms). |
Product Details
HY-AD03 is an atmospheric direct plasma cleaning device designed for surface cleaning, activation and modification under ambient air conditions. It features concentrated energy with a small treatment footprint, which effectively improves product adhesion, hydrophilicity and printability. It can also remove contaminants such as organic residues, oil stains and oxide layers from material surfaces.
HY-TM500 works under atmospheric pressure without vacuum chambers. Custom 3-axis rails deliver full-coverage precise treatment. Built with military-grade hardware and digital control, it supports 0–800W adjustable power. Zero-potential low-temperature plasma protects PCB, FPC and semiconductor components, completing surface cleaning, activation and modification to boost adhesion for bonding, printing and coating. It is ready for inline automation in 3C, display, semiconductor, automotive and new energy industries.
HY-DC1000 is equipped with a wide coverage rotary gun and interchangeable nozzles ranging from 20 to 80mm, customized for large flat workpieces including full-size PCBs, new energy battery electrodes, automotive plastic components and display glass panels. It supports 0–1000W wide-range adjustable power to form uniform plasma coverage over large surfaces, efficiently stripping organic contaminants and eliminating printing voids & coating delamination issues for mass-production inline assembly lines.
HY-DD600 adopts narrow small nozzle design (2–6mm effective width), dedicated for tiny precision sensitive parts including chips, FPC flexible circuits, miniature BGA substrates. Zero-potential low-temperature plasma jet eliminates thermal burn risk for ultra-thin PI/ITO materials. Its compact gun fits narrow gaps and complex micro-structures, perfectly matching small automatic bonding & dispensing lines for semiconductor packaging and camera module pretreatment.
HY-AC500 adopts rotary plasma spray gun and dual manual & I/O control modes, realizing uniform cleaning, activation and micro-etching for PCB, FPC, BGA and semiconductor chips. It features military-grade hardware, digital real-time monitoring and multi-layer safety protection. This desktop 1000W analog plasma machine is widely used for pre-treatment in semiconductor packaging, 3C electronics, display, automotive electronics and new energy industries.
HY-AC1000H uses vacuum-free low-temperature neutral plasma, fitted with customizable rails and dual rotary guns. With 0–1000W adjustable power and 20–80mm treatment width, it safely cleans chips without thermal damage. Combined physical & chemical dry cleaning enhances bonding for die attach, wire bonding and molding to reduce delamination and voids. Supporting manual & IO control with full safety monitoring, it connects to auto lines for continuous processing of substrates, lead frames and large FPC panels, delivering stable long-hour full-load production with response time below 0.1s.
HY-AS1200 is fitted with a motor-driven rotating nozzle to create an even plasma surface. With a treatment width of 20–80 mm and adjustable power ranging from 0 to 1200 W, it perfectly matches batch pre-treatment of large-area lead frames and substrates. The room-temperature neutral plasma will not damage chips, dry removing organic residues and surface oxides under atmospheric pressure to strengthen adhesion for die attach, wire bonding and molding while cutting delamination and void defects. Equipped with multi-layer safety protection and fully compatible with automated production lines, this equipment is widely used in packaging and testing procedures for ICs, FPCs and automotive chips.
HY-AD800 safely processes delicate chips, PCBs and plastic components without thermal deformation. Equipped with 0–800W adjustable power, IO/manual dual operation and complete safety protection, it can be easily integrated into automated production lines for surface cleaning, activation and improved bonding, making it ideal for semiconductor packaging, 3C electronics, automotive, new energy and LED manufacturing.
leave a message
Scan To Wechat :
Scan To WhatsApp :
