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HY-AD800 safely processes delicate chips, PCBs and plastic components without thermal deformation. Equipped with 0–800W adjustable power, IO/manual dual operation and complete safety protection, it can be easily integrated into automated production lines for surface cleaning, activation and improved bonding, making it ideal for semiconductor packaging, 3C electronics, automotive, new energy and LED manufacturing.
Brand :
HYRNUSItem No. :
HY-AD800Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaAtmospheric Low-Temperature Direct Injection Plasma Cleaner for Wire Bonding, Die Bonding And Molding
Product Introduction
HY-AD800 Atmospheric Low-Temperature Direct Injection Plasma Cleaner is an atmospheric surface treatment unit. With low-temperature processing design, it avoids damage to delicate precision parts including chips, PCBs and plastic components. Featuring 0–800W stepless adjustable power, it supports IO control and manual operation, and can be seamlessly integrated into automated production lines to deliver surface cleaning, activation and enhanced bonding performance. Widely adopted for semiconductor die packaging, 3C electronics, automotive, new energy and LED manufacturing, it comes with comprehensive multi-layer safety protection for stable, long-term continuous operation.
Product Application
Suitable for small precision, curved and special-shaped workpieces. It is widely applied in pre-treatment processes for semiconductor packaging, 3C electronics, touch displays, LED packaging, auto parts, new energy lithium batteries, plastics, metals and glass. It performs surface cleaning, molecular activation and micro-etching to fundamentally resolve manufacturing defects such as poor adhesion, glue delamination and ink shedding.
Product Features
1. Constructed with military-spec hardware architecture, this unit works reliably within an ambient temperature window of -25°C to 50°C to cope with rigorous industrial scenarios. Its Mean Time Between Failures (MTBF) exceeds 190,000 hours under 25°C testing following the MIL-HDBK-217F reliability standard.
2. Fully digital control panel paired with digital readouts enables real-time operational surveillance and robust anti-interference capacity.
3. Integrated built-in detection modules support air pressure tracking, mainboard temperature inspection and power regulation.
4. Proprietary smart chip centralized control realizes instant real-time monitoring with a response speed faster than 0.1s and outstanding anti-jamming performance.
5. The plasma power factor maintains above 79%, delivering balanced dynamic operation and full saturation of electrode discharge.
6. Comprehensive safety safeguard mechanisms cover overheat, overload, short-circuit, open-circuit, electric leakage and all forms of incorrect operation.
Equipment Structure
The atmospheric direct-injection plasma surface treatment system consists of three major components: power generator, plasma generating spray gun and control system.
1. Power Generator
It supports automatic power matching to maintain stable, high-precision power output, which remains unaffected by gas pressure fluctuations. Users can adjust parameters based on actual sample conditions to acquire optimal treatment performance.
2. Direct-Injection Plasma Spray Gun
It is tailored for small-size and complex-shaped materials, featuring an effective treatment width of 2mm to 6mm. Compatible with existing production assembly lines, it enables fully automatic inline processing to lower manual labor costs.
3. Control System
The control system is integrated inside the main cabinet of the power generator. It controls the operation of the atmospheric plasma cleaner and delivers comprehensive safety protection for the entire equipment system.
Technical Specifications: Atmospheric Plasma Generator Main Unit
1. Atmospheric Plasma Generator
(1) Main Unit Parameters
| Item | Parameter |
| Model | HY-AD800 |
| Overall Dimension | 479200325mm (LWH) |
| Weight | 10KG |
| Input Power Supply | AC220V |
| Power Frequency | 25KHz |
| Plasma Output Power | 0–800W, adjustable & displayable |
| Control Mode | IO Control / Manual Control |
| Protection & Alarm | Temperature, air pressure, overload, leakage, short-circuit, open-circuit protection |
| Detection Functions | Air pressure detection, power detection, mainboard temperature detection |
(2) Direct Injection Plasma Spray Gun Specifications
| Item | Parameter |
| Spray Gun Dimension | 228mm*75mm |
| Standard Nozzle Sizes | 2mm, 4mm, 6mm |
| Plasma Treatment Height | 3–20mm |
| Effective Treatment Width | 1–8mm |
| Air Pressure Range | Standard 0.2Mpa, adjustable 0.08–0.25Mpa |
2. Factory Installation Requirements
| Item | Requirement |
| Power Supply | Single-phase AC220V, 10A; grounding resistance ＜4Ω |
| Exhaust System | Flow rate: 5m³/min; corrosion-resistant material |
| Compressed Air | Pipe diameter: 8mm, PU tube |
| Pressure: 0.4–0.6Mpa | |
| Air quality: solid particle ≤0.1μm, oil content ≤0.01mg/m³, dew point ≤-40℃ |
General specifications for our industrial atmospheric plasma surface treatment machine include a high-voltage hazard warning label for safety alert. The equipment operates stably under an ambient temperature of 15~35°C and relative humidity of 30~80%. To guarantee safe operation and extend the service life of this plasma cleaning equipment, the working area must be kept free of flammable gas, corrosive gas, explosive and reactive dust at all times.
Plasma Generator Dimensions
Main Unit Outline Dimension Drawing
Plasma Gun Dimensions
Product Details
HY-AD03 is an atmospheric direct plasma cleaning device designed for surface cleaning, activation and modification under ambient air conditions. It features concentrated energy with a small treatment footprint, which effectively improves product adhesion, hydrophilicity and printability. It can also remove contaminants such as organic residues, oil stains and oxide layers from material surfaces.
HY-TM500 works under atmospheric pressure without vacuum chambers. Custom 3-axis rails deliver full-coverage precise treatment. Built with military-grade hardware and digital control, it supports 0–800W adjustable power. Zero-potential low-temperature plasma protects PCB, FPC and semiconductor components, completing surface cleaning, activation and modification to boost adhesion for bonding, printing and coating. It is ready for inline automation in 3C, display, semiconductor, automotive and new energy industries.
HY-DC1000 is equipped with a wide coverage rotary gun and interchangeable nozzles ranging from 20 to 80mm, customized for large flat workpieces including full-size PCBs, new energy battery electrodes, automotive plastic components and display glass panels. It supports 0–1000W wide-range adjustable power to form uniform plasma coverage over large surfaces, efficiently stripping organic contaminants and eliminating printing voids & coating delamination issues for mass-production inline assembly lines.
HY-DD600 adopts narrow small nozzle design (2–6mm effective width), dedicated for tiny precision sensitive parts including chips, FPC flexible circuits, miniature BGA substrates. Zero-potential low-temperature plasma jet eliminates thermal burn risk for ultra-thin PI/ITO materials. Its compact gun fits narrow gaps and complex micro-structures, perfectly matching small automatic bonding & dispensing lines for semiconductor packaging and camera module pretreatment.
HY-AC500 adopts rotary plasma spray gun and dual manual & I/O control modes, realizing uniform cleaning, activation and micro-etching for PCB, FPC, BGA and semiconductor chips. It features military-grade hardware, digital real-time monitoring and multi-layer safety protection. This desktop 1000W analog plasma machine is widely used for pre-treatment in semiconductor packaging, 3C electronics, display, automotive electronics and new energy industries.
HY-AC1000H uses vacuum-free low-temperature neutral plasma, fitted with customizable rails and dual rotary guns. With 0–1000W adjustable power and 20–80mm treatment width, it safely cleans chips without thermal damage. Combined physical & chemical dry cleaning enhances bonding for die attach, wire bonding and molding to reduce delamination and voids. Supporting manual & IO control with full safety monitoring, it connects to auto lines for continuous processing of substrates, lead frames and large FPC panels, delivering stable long-hour full-load production with response time below 0.1s.
HY-AS1200 is fitted with a motor-driven rotating nozzle to create an even plasma surface. With a treatment width of 20–80 mm and adjustable power ranging from 0 to 1200 W, it perfectly matches batch pre-treatment of large-area lead frames and substrates. The room-temperature neutral plasma will not damage chips, dry removing organic residues and surface oxides under atmospheric pressure to strengthen adhesion for die attach, wire bonding and molding while cutting delamination and void defects. Equipped with multi-layer safety protection and fully compatible with automated production lines, this equipment is widely used in packaging and testing procedures for ICs, FPCs and automotive chips.
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