automatic wire bonder

The HY-WB600 Gold Wire Bonder is designed for internal chip-to-pin interconnection in special electronic components such as discrete devices, microwave devices, lasers and optical communication devices. It supports customized workholders, stable ultrasonic output, gold wire bonding and stud bumping, with optional alloy, copper and silver wire processes.

The HY-WB900 Deep Access Wedge Wire Bonder is designed for chip-to-pin interconnection in advanced electronic component packaging. It supports hybrid circuits, COB, MCM, MEMS, RF, optoelectronic and automotive modules, featuring real-time bonding deformation monitoring, ultrasonic energy feedback, precise loop control and consistent tail wire management.

HY-WB300 Wire Bonding Machine is a high-precision fully automatic wire bonding system designed for advanced semiconductor packaging, supporting SOT, SOP, MEMS, DFN, QFN, SiP, and various package forms with compatibility for gold, copper, silver, palladium-plated copper, alloy wires, and more.

HY-WB200 Wire Bonder is a high-precision automatic wire bonding system supporting SOT, SOP, MEMS, DFN, QFN, SiP, and various package forms, compatible with gold, copper, silver, and alloy wires. 

HY-WB2000 ultrasonic wire bonder uses fine aluminum wire, pressure, and ultrasonic energy to create reliable electrical connections between chips and substrates. It is suitable for microwave devices, RF modules, hybrid circuits, MEMS, optoelectronic devices, sensors, semiconductor devices, radar devices, COB/SOB packaging, and other microelectronic applications.