IC Packaging Gold Wire Bonder Flip Chip Wire Bonding Machine

Product Introduction

The HY-WB600 Gold Wire Bonder is designed for the internal pin interconnection process of chips in special electronic component production. It is widely used in discrete devices, microwave devices, lasers, optical communication devices and other precision electronic components.

The machine supports customized workholders and fixtures according to customer product requirements, making it suitable for special device packaging with cavity depths below 6.5 mm. It is equipped with a stable and powerful ultrasonic system and an integrated electrical control platform to ensure reliable bonding performance.

The standard configuration supports gold wire bonding and gold wire stud bumping. Optional alloy wire, copper wire and silver wire bonding or stud bumping processes are also available to meet different packaging and flip-chip application requirements.

Features

Technical Specifications

No.	Parameter	Specification
1.	Workholder (Customizable)
2.	Workholder Z Travel	23 mm
3.	Heater Temperature	Room temperature ~ 300°C
4.	Workholder X-Y Range	72 mm × 70 mm
5.	Operating System	Windows
6.	Bonding Travel	60 mm × 68 mm
7.	Min Bond Pad Pitch	45 μm
8.	Bonding Accuracy	±2 μm @ 3σ
9.	Wire Diameter	18 μm ~ 50 μm
10.	Max Wire Length	7 mm
11.	Min Loop Height	60 μm
12.	Loop Height Accuracy	±25.4 μm
13.	Wire Swing	±25 μm
14.	Loop Control	Fully programmable
15.	Optical Path	2~4 / 1.6~3.6 continuous zoom, programmable auto focus
16.	Standard Bonding Speed	45 ms/wire cycle time
17.	Chip Position Tolerance	X: ±190 μm, Y: ±140 μm
18.	Standard Stud Bumping Speed	28 units/sec
19.	Ultrasonic Power	0~2 W
20.	Chip Angle Tolerance	Rotation ±45°
21.	Input Voltage	AC 220V ± 10% (50 Hz)
22.	Bonding Force	0~360 g
23.	Weight	Net: 600 kg
24.	Compressed Air Requirement	0.35~1 MPa, Φ10 air fitting
25.	Dimensions (W×D×H)	1300 × 1000 × 1700 mm
26.	Rated Air Consumption	150 L/min @ 0.5 MPa