What Are You Looking For?
HY-WB300 Wire Bonding Machine is a high-precision fully automatic wire bonding system designed for advanced semiconductor packaging, supporting SOT, SOP, MEMS, DFN, QFN, SiP, and various package forms with compatibility for gold, copper, silver, palladium-plated copper, alloy wires, and more.
Brand :
HYRNUSItem No. :
HY-WB300Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaHigh Performance Fully Automatic Wire Bonding Machine for Advanced Semiconductor Packaging
Product Introduction
HY-WB300 Wire Bonder features industrial IoT connectivity for real-time equipment status tracking, automatic parameter programming with self-learning optimization, and two selectable frequencies for optimal bonding performance. Supporting wire diameters from 0.6 to 2.0 mil for gold, copper, silver, and palladium-plated copper wires, the HY-WB300 offers comprehensive material compatibility. The high-speed, low-inertia bonding head, combined with a 2–6x continuous zoom vision system and high-speed image processing engine, ensures precise wire placement across diverse applications. Programmable loop profiles include ultra-low loops, space polyline arcs, butterfly loops, and M-loops, with the proprietary butterfly algorithm delivering over 2000 thermal shock cycles for 2835 dual-wire products and the M-loop algorithm upgrading thermal shock resistance from 500 to 1500 cycles. Changeover times under 4 minutes for same-type and under 8 minutes for different-type lead frames dramatically reduce downtime. The 21.5-inch LCD monitor with color-coded bond groups and intuitive drop-down menus simplifies operation. With compact dimensions of 1025×814×1810 mm and approximately 640 kg net weight, the HY-WB300 is the premier choice for high-volume, high-reliability wire bonding operations.
Equipment Features
HY-WB300 boasts superior craftsmanship.
Fully upgraded automatic loading/unloading and material transport system.
Newly designed spark box with improved ball formation capability.
Intelligent wire path recovery to maximize MTBA (Mean Time Between Assists).
Automatic parameter programming and self-learning optimization.
Two selectable frequencies for optimal bonding performance.
Real-time equipment status tracking via industrial IoT connectivity.
Equipped with a new high-speed identification device.
High-speed bonding head achieved low inertia.
Wide range of wire bonding areas.
Multiple image recognition systems.
Supports features for complex wire bonding programming.
Suitable for SOT/SOP/MEMS/DFN/QFN/SiP and other various package forms.
Suitable for gold wire, copper wire, silver wire, palladium-plated copper wire, gold palladium copper wire, alloy wire, etc.
Programmable various line arcs: ultra-low line arc, space polyline arc, etc
Key Technical Specifications
| HY-WB300 Series Specifications | ||
| WIRE BONDING CAPABILITY | Bonding Area | X: 56 mm, Y: 80 mm |
| Bonding Accuracy | ±2.0 µm @ 3 sigma (varies by product & process) | |
| Bonding Speed | 22 wires/sec (2 mm wire length) | |
| PR System | 2–6x continuous zoom adjustable (optional) | |
| High and low magnification dual lenses (optional) | ||
| High-speed, high-precision image processing engine | ||
| CCD camera | ||
| LOOPING CAPABILITY (25.4µm wire diameter) | Maximum Wire Length | 7.6 mm (1.0 mil) / 3.0 mm (0.7 mil) |
| Minimum Loop Height | Min. 50 µm (0.7 mil) | |
| Wire Sway | ±25 µm @ 3 sigma (wire length < 2.54 mm) | |
| ±1% of wire length @ 3 sigma (wire length > 2.54 mm) | ||
| Applicable Wire Diameter | 0.6–2.0 mil (Cu / Ag / Au) | |
| CONVERSION TIMES | Same Lead Frame Type | <4 min (including heater insertion, clamp change & program download) |
| Different Lead Frame Type | <8 min (including lead frame size change, magazine size change, heater/clamp change & program download) | |
| MATERIAL HANDLING CAPABILITIES | Package / Lead Frame Size | Length L: 100–300 mm |
| Width W: 15–105 mm | ||
| Thickness THK: 0.1–0.9 mm | ||
| MAGAZINE SIZE | Length L | 127–305 mm |
| Width W | 20–125 mm | |
| Height H | 50–180 mm Max. | |
| Magazine Pitch | 1.27–25 mm | |
| Max. Magazine Weight | 4.2 kg | |
| MAN-MACHINE INTERFACE | Monitor | 21.5" LCD |
| Control Panel | Durable control panel with robust switches | |
| User Interface | Simple drop-down menu; wire bond groups color-marked for easy editing & programming | |
| FACILITY REQUIREMENTS | Minimum Air Pressure | 0.35 MPa |
| Input Voltage | Single-phase AC220V ±5%, 50Hz | |
| Power Consumption | 1.5 kVA (typical), 2.0 kVA (max.) | |
| SIZE | Dimensions (L × W × H) | 1025 × 814 × 1810 mm |
| WEIGHT (ESTIMATE) | Net Weight (N.W.) | Approx. 640 kg |
| Gross Weight (G.W.) | Approx. 705 kg (with packaging) | |
| GAS CONSUMPTION | Nitrogen Flow | 0.6 L/min (adjustable per material & wire) |
| Nitrogen-Hydrogen Ratio | N₂ 95% : H₂ 5% | |
| Compressed Air Consumption | 150 L/min (No Vacuum) | |
| 180 L/min (Vacuum) | ||
Package
Multi-segment arc + standard arc + flat wire
Supports multiple wire loops with stable loop height control
BSOB Mode for IC Packaging
Adaptable to high wire count (82 wires) and large span between the first and second bonding points.
Multi-Layer Wire Loop Support
Deflected Standard +D / Standard Loop
Deflected Flat Loop / Flat Loop
Spatial Z-Loop / P-Loop
Spatial Broken Loop / M-Loop
Grounding Loop / Standard Loop +D
Question Mark Loop / Ultra-Low Broken Loop
Provides solutions for special process wire loopsOffset Standard +D / Standard Loop
Offset Flat Loop / Flat Loop
Spatial Z-Loop / P-Loop
Spatial Broken Loop / M-Loop
Grounding Loop / Standard Loop +D
Question-Mark Loop / Ultra-Low Broken Loop
Low-to-high bonding products:
Adopting a high-precision and exclusive M-loop profile algorithm, the thermal shock resistance is upgraded from 500 cycles to 1500 cycles.
Low-to-high bonding products:
For loop heights of 300–500 μm, the stability of the vertical section of wire loops is effectively improved.
High-precision and exclusive butterfly loop profile algorithm:
It enhances product reliability. The 2835 dual-wire products achieve a thermal shock resistance of over 2000 cycles.
Product Details
FAQs
The HY-WB300 features fully upgraded automatic loading/unloading and material transport systems, a newly designed spark box for improved ball formation, intelligent wire path recovery for maximizing MTBA, industrial IoT connectivity for real-time status tracking, and automatic parameter programming with self-learning optimization—delivering superior automation and reliability.
The HY-WB300 achieves bonding accuracy of ±2.0 μm at 3 sigma with bonding speeds of 22 wires per second for 2 mm wire length. The 2–6x continuous zoom vision system and high-speed image processing engine ensure precise wire placement for demanding semiconductor packaging applications.
The system supports over a dozen programmable loop profiles including butterfly, M-loop, Z-loop, flat loop, grounding loop, and question-mark loops. The proprietary butterfly and M-loop algorithms deliver enhanced thermal shock resistance. It accommodates gold, copper, silver, and palladium-plated copper wires from 0.6 to 2.0 mil diameter.
Changeover for same-type lead frames is completed in under 4 minutes, including heater insertion, clamp change, and program download. Different-type lead frame changeover takes under 8 minutes, significantly reducing downtime and improving overall equipment effectiveness for high-mix production environments.
HY-WB250M / HY-WB250PM Ball Wedge Bonding Machine is designed for internal wire interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, optoelectronic, microwave and automotive electronic devices. It supports products under 200 mm, accommodates different cavity depths and provides stable ultrasonic output for reliable bonding performance.
HY-BW830 Wire Bonder is an aluminum wire bonding system designed for power module assembly, primarily used for lead connection between batteries and bus bars, supporting aluminum wire diameters of 125–500 μm.
HY-HW3741A Automatic Ultrasonic Heavy Aluminum Wire Wedge Bonder features a rotary bonding head, automatic digital frequency tracking, precise pressure control, advanced image recognition, and closed-loop motion control.
HY-HW3850 Automatic Ultrasonic Heavy Aluminum Wire Wedge Bonder is designed for high-efficiency wire bonding of power semiconductor packages such as TO-220, TO-247, TO-252, TO-251 and TO-263. Featuring dual bonding heads, PR visual positioning and automatic loading and unloading, it supports aluminum wire diameters from 125 to 500 μm, delivering accurate, stable and consistent bonding for mass production.
HY-HW3200 Ultrasonic Heavy Aluminum Wire Wedge Bonder is designed for internal wire bonding of power semiconductor devices such as MOSFETs, high-power transistors, diodes, thyristors and power modules. It features precise motion control, adjustable bonding parameters, stable ultrasonic output and support for 1–6 bonding points, ensuring reliable bonding quality and efficient operation.
HY-WB200 Wire Bonder is a high-precision automatic wire bonding system supporting SOT, SOP, MEMS, DFN, QFN, SiP, and various package forms, compatible with gold, copper, silver, and alloy wires.
HY-RW4000 Precision Semiconductor Wire Re-bonding Machine is specialized machinery designed specifically for PCB (printed circuit board) manufacturers to re-bonding circuit boards.
leave a message
Scan To Wechat :
Scan To WhatsApp :
