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HY-WB200 Wire Bonder is a high-precision automatic wire bonding system supporting SOT, SOP, MEMS, DFN, QFN, SiP, and various package forms, compatible with gold, copper, silver, and alloy wires.
Brand :
HYRNUSItem No. :
HY-WB200Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaHigh-Precision Automatic Wire Bonder for Chips
Product Introduction
HY-WB200 Wire Bonding Machine supports a wide range of wire materials including gold, copper, silver, palladium-plated copper, gold-palladium copper, and alloy wires, with wire diameters from 0.7 to 2.0 mil. Programmable wire loop profiles—including ultra-low loops, space polyline arcs, butterfly loops, and M-loops—address diverse application requirements from LED RGB displays to complex IC packaging with up to 82 wires. The proprietary butterfly loop algorithm enhances product reliability, achieving over 2000 thermal shock cycles for 2835 dual-wire products, while the M-loop algorithm upgrades thermal shock resistance from 500 to 1500 cycles for low-to-high bonding applications. Changeover times under 5 minutes for same-type lead frames and under 20 minutes for different types minimize production interruptions.
Equipment Features
Equipped with a new high-speed identification device
High-speed bonding head achieved low inertia
Wide range of wire bonding areas
Multiple image recognition systems
Supports features for complex wire bonding programming
Suitable for SOT/SOP/MEMS/DFN/QFN/SIP and other various package forms
Suitable for gold wire, copper wire, silver wire, palladium-plated copper wire, gold palladium copper wire, alloy wire, etc.
Programmable various line arcs: ultra-low line arc, space polyline arc, etc.
Key Technical Specifications
| Bonding Capability | Bonding Area | X-axis: 56mm, Y-axis: 76mm |
| Bonding Accuracy | ±3.0µm @ 3 sigma | |
| Bonding Speed | 22 wires/sec for 2mm wire (varies by product & process) | |
| Vision System | 2–4x continuous adjustable magnification; high/low dual lens (optional) | |
| Image recognition accuracy: ±0.5µm | ||
| Angle deviation up to ±30° recognizable | ||
| Programmable red/blue illumination | ||
| Wire Loop Capability (25.4µm Wire) | Max. Loop Length | 5.5mm |
| Min. Loop Height | 70µm | |
| Loop Placement Accuracy | ±25µm @ 3 sigma (for bond length < 2.54mm) | |
| ±1% of bond length @ 3 sigma (for bond length > 2.54mm) | ||
| Applicable Wire Diameter | 0.7–2.0 mil | |
| Product Changeover Time | Same type lead frame | <5 min (including heater block insertion, clamp change & program download) |
| Different type lead frame | <20 min (including lead frame width/length change, magazine size change, heater block/clamp change & program download) | |
| Material Handling Capability | Package / Lead Frame Size | Length: 100–280mm |
| Width: 28–83mm | ||
| Thickness: 0.1–0.8mm | ||
| Magazine Size | Length | 100–285mm |
| Width | 35–95mm | |
| Height | 100–180mm Max. | |
| Pitch | 4.5 / 5.0 / 5.2 / 5.5mm (optional) | |
| Human-Machine Interface | Display | 19" color LCD monitor |
| Control Panel | Durable operation switches, user-friendly interface | |
| User Interface | Simple pull-down menu; bond groups color-coded; easy programming | |
| Operating Requirements | Min. Air Pressure | 0.4 MPa (4 kgf/cm²) |
| Input Voltage | Single-phase AC220V ±5%, 50Hz | |
| Power Consumption | 1.5 kVA (typical), 2.0 kVA (max.) | |
| Equipment Dimensions | L × W × H | 1180 × 910 × 1970 mm |
| Weight (Estimated) | Net Weight | Approx. 640kg |
| Gross Weight | Approx. 705kg (with packaging) | |
| Gas Consumption | Nitrogen Flow | 0.3L/min (adjustable per material & wire) |
| N₂:H₂ Ratio | 95% Nitrogen : 5% Hydrogen | |
| Compressed Air Consumption | 150L/min (no vacuum) | |
| 180L/min (with vacuum) |
Multi-Layer Wire Loop Support
Deflected Standard +D / Standard Loop
Deflected Flat Loop / Flat Loop
Spatial Z-Loop / P-Loop
Spatial Broken Loop / M-Loop
Grounding Loop / Standard Loop +D
Question Mark Loop / Ultra-Low Broken Loop
Provides solutions for special process wire loops
Offset Standard +D / Standard Loop
Offset Flat Loop / Flat Loop
Spatial Z-Loop / P-Loop
Spatial Broken Loop / M-Loop
Grounding Loop / Standard Loop +D
Question-Mark Loop / Ultra-Low Broken Loop
LED RGB Display
Package
Multi-segment arc + standard arc + flat wire
Supports multiple wire loops with stable loop height control
Product Details
FAQs
The HY-WB200 Series delivers bonding accuracy of ±3.0 μm at 3 sigma with bonding speeds reaching 22 wires per second for 2 mm wire length. This combination of precision and throughput ensures high-yield production for demanding semiconductor packaging applications.
The system accommodates a broad range of wire materials including gold, copper, silver, palladium-plated copper, gold-palladium copper, and alloy wires, with diameters ranging from 0.7 to 2.0 mil, providing flexibility for diverse packaging requirements.
The system supports over a dozen programmable loop profiles including deflected standard loops, flat loops, spatial Z-loops, P-loops, M-loops, grounding loops, question-mark loops, and ultra-low broken loops. The proprietary butterfly and M-loop algorithms deliver enhanced thermal shock resistance for demanding applications.
Changeover time for same-type lead frames is under 5 minutes, including heater block insertion, clamp change, and program download. For different type lead frames, changeover is completed in under 20 minutes, minimizing production downtime and maximizing equipment utilization.
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