manual wire bonding machine

HY-WB350PM / HY-WB350M Gold Wire Wedge Bonding Machine is designed for internal chip-to-pin interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, microwave, optoelectronic and automotive electronic devices. It supports products under 200 mm and provides stable ultrasonic output for reliable bonding performance.

HY-WB150M Gold Ribbon Bonding Machine is designed for internal chip-to-pin interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, microwave, optoelectronic and automotive electronic devices. It supports products under 200 mm and provides stable ultrasonic output for reliable and consistent bonding.

HY-WB450M / HY-WB450PM Copper Wire Bonding Equipment is designed for internal chip-to-pin interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, optoelectronic, microwave and automotive electronic devices. It supports products under 200 mm and provides stable ultrasonic output for reliable and consistent bonding.

HY-WB250M / HY-WB250PM Ball Wedge Bonding Machine is designed for internal wire interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, optoelectronic, microwave and automotive electronic devices. It supports products under 200 mm, accommodates different cavity depths and provides stable ultrasonic output for reliable bonding performance.

HY-RW4000 Precision Semiconductor Wire Re-bonding Machine is specialized machinery designed specifically for PCB (printed circuit board) manufacturers to re-bonding circuit boards.