Precision Semiconductor Wire Re-bonding Machine for PCB Re-bonding

Product Introduction

HY-RW4000 Precision Wire Re-bonding Machine can re-bonding a wide variety of circuit boards, including single-sided boards, multilayer boards, outer-layer boards, inner-layer boards, rigid substrates (such as fiberglass and aluminum substrates), and flexible substrates, with re-bonding capabilities covering all line widths. The equipment is easy to operate, provides reliable soldering, and is user-friendly. With proper training, ordinary employees can typically master the re-bonding method within 2 hours and become proficient in performing re-bonding tasks within 2 weeks. re-bondinged circuits maintain excellent electrical performance and can withstand the board grinding process without being affected.

The PCB circuit re-bonding equipment performs precision circuit re-bonding operations under direct visual inspection via a display screen. Soldering is performed by adjusting three parameters: soldering force (Force), output pulse amplitude (Voltage), and pulse duration (Milliseconds). 

The PCB circuit re-bonding equipment consists of four components: 

Component	Core Function	Key Parameters / Configuration
Main Unit	Supplies welding current	Voltage range: 0.01–1.99V, resolution: 0.01VTime range: 1–19 ms, resolution: 1 ms
Welding Head	Provides welding pressure	Pressure range: 1–70 ozTriggers energy output via preset pressure; welding controlled by foot pedal
Optical System	Magnified viewing for precision welding	Includes single-channel microscope, stand, light source, camera, monitor, etc.
Workbench & Stand	Supports the whole equipment	Consists of worktable and welding head support frame

Technical Parameter

Item	Details
Power supply	220 VAC, 50 Hz, 300 VA
Maximum output current	350 A
Pulse voltage	0.01–1.99 V
Pulse duration	1–19 ms
Welding frequency	180 cycles/min
Input power	110V/220V ±5%, 50/60 Hz
Welding voltage	DC 0.01–1.99 V
Welding time	0–19 ms
Welding pressure	10–70 oz
Maximum welding power	500 VA
Welding head stroke	5–10 mm
Worktable size (tempered glass)	Standard	750 × 800 mm
	Optional	950 × 800 mm
	Maximum working size	700 mm
Re-bonding yield rate	95%–98% (varies by manufacturer requirements)

 

*Continuous zoom monocular microscope

*LED lighting for microscope

*CCD camera: 2 megapixels (1920×1080), 60 Hz

*22-inch LCD monitor