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HY-WB150M Gold Ribbon Bonding Machine is designed for internal chip-to-pin interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, microwave, optoelectronic and automotive electronic devices. It supports products under 200 mm and provides stable ultrasonic output for reliable and consistent bonding.
Brand :
HYRNUSItem No. :
HY-WB150MOrder(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaGold Ribbon Bonding Machine Semiconductor Wedge Wire Bonder
Product Introduction
HY-WB150M Gold Ribbon Bonding Machine is designed for internal chip-to-pin interconnection in special electronic component packaging. It is suitable for hybrid circuits, COB modules, MCMs, MEMS devices, RF and microwave modules, optoelectronic devices, military electronics and automotive electronic modules.
The machine supports devices with dimensions below 200 mm. By replacing bonding tools of different lengths, it can accommodate cavity depths from 12 mm to 15 mm or 21 mm. It also supports zero-tail stud bumping and features stable ultrasonic energy output and an integrated electrical control system, helping ensure reliable operation and consistent bonding quality.
Applications
Features
| No. | Feature |
| 1 | Advanced Process Learning with Chinese Touchscreen Interface |
| 2 | Adaptable to devices with different cavity depths (ranging from 12 mm to 15 mm/21mm) by replacing capillary models of different lengths |
| 3 | Capable of zero wire tail bumping (stud bumping) function |
| 4 | DSP Phase-Locked Control for Stable Ultrasonic Output |
| 5 | Outstanding Fine Wire Bonding Control and Soft Substrate Adaptability |
Main Technical Specifications
| NO | Section | Parameter | Specification | Other Parameters | |
| 1. | Bond Head | Z Travel | 18 mm | Spool Size | 1/2 inch |
| 2. | X-Y Range | X: 15 mm, Y: 15 mm | |||
| 3. | Lift Table | Z Travel | 0~18 mm | Heater Temperature | Room temperature ~ 200°C |
| 4. | X-Y Range | 250 mm × 270 mm | Operation Menu | 7" TFT touch screen, Chinese menu | |
| 5. | Ultrasonic Power | Digitally controlled, 1000x subdivision | Power Supply | 220V ± 10% @ 50/60Hz, ≤500W | |
| 6. | Bonding Force | 1~250 g | Footprint (W×D×H) | ≤620 × 640 × 450 mm | |
| 7. | Wire Types | Gold ribbon 50×12.5 ~ 300×25.4 μm | Weight | Gross: approx. 70 kg; Net: approx. 45 kg | |
| 8. | Standard Configuration | Main unit, 1/2 inch spool, LED lighting, stereo microscope, workholder, 90° wire feeder | |||
Terms of use
| No | Item | Requirements |
| 1. | Parameter | Specification |
| 2. | Ambient Temperature (Room Temperature) | 15°C ~ 30°C |
| 3. | Ambient Relative Humidity | 30% ~ 60% (no condensation) |
| 4. | Vibration | Vibration may affect equipment accuracy; keep away from vibration sources |
| 5. | Power Requirements | 1. 220V ± 10% 2. Power ≤ 500W 3. Frequency: 50/60Hz |
| 6. | Grounding | Must be properly grounded. Follow local regulations for grounding specifications. |
| 7. | Voltage | 220V ± 10% |
| 8. | Frequency | 50/60Hz |
| 9. | Grounding | Must be grounded |
| 10. | Power | ≤ 500W |
| 11. | Interface Specification | 5A, Single-phase 3-wire |
Product Details
FAQs
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