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HY-WB450M / HY-WB450PM Copper Wire Bonding Equipment is designed for internal chip-to-pin interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, optoelectronic, microwave and automotive electronic devices. It supports products under 200 mm and provides stable ultrasonic output for reliable and consistent bonding.
Brand :
HYRNUSItem No. :
HY-WB450M / HY-WB450PMOrder(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaManual Wire Bonder Ball Wedge Bonding Machine
Product Introduction
HY-WB450M / HY-WB450PM Copper Wire Bonding Equipment is designed for internal chip-to-pin interconnection in special electronic component packaging. It is suitable for hybrid circuits, COB modules, MCMs, MEMS devices, RF and microwave modules, optoelectronic devices, military electronics and automotive electronic modules.
The machine can process devices with dimensions below 200 mm. By replacing capillaries of different lengths, it can accommodate cavity depths ranging from 12 to 15 mm. It also supports zero-tail stud bumping and features stable ultrasonic energy output and an integrated electrical control system, ensuring reliable operation and consistent bonding quality.
Applications
Features
| No. | Feature |
| 1 | Closed-Loop Pressure Control System |
| 2 | Unique Zero-Tail Ball Placement Technology |
| 3 | Designed for Deep-Cavity & Large-Module Packages |
| 4 | Fully Electric Drive – No Compressed Air Required |
| 5 | DSP Phase-Locked Technology for Stable Ultrasonic Performance |
Main Technical Specifications
| NO | Section | Parameter | Specification | Other Parameters | |
| 1. | Bond Head | Z Travel | 18 mm | Spool Size | 1/2 inch |
| 2. | X-Y Range | X: 15 mm, Y: 15 mm | |||
| 3. | Lift Table | Z Travel | 0~18 mm | Heater Temperature | Room temperature ~ 200°C |
| 4. | X-Y Range | 250 mm × 270 mm | Operation Menu | 7" TFT touch screen, Chinese menu | |
| 5. | Ultrasonic Power | Digitally controlled, 1000x subdivision | Power Supply | 220V ± 10% @ 50/60Hz, ≤500W | |
| 6. | Bonding Force | 1~250 g | Footprint (W×D×H) | ≤620 × 640 × 450 mm | |
| 7. | Wire Types |
HY-WB450M : Gold wire 15~75 μm, Platinum wire 18~25 μm, Silver wire 18~50 μm HY-WB450PM : Gold wire 15~75 μm, Platinum wire 18~25 μm, Silver wire 18~50 μm，Copper wire 18~50 μm |
Weight | Gross: approx. 70 kg; Net: approx. 45 kg | |
| 8. | Standard Configuration | Main unit, 1/2 inch spool, LED lighting, Stereo microscope, Workholder | |||
Terms of use
| No | Item | Requirements |
| 1. | Parameter | Specification |
| 2. | Ambient Temperature (Room Temperature) | 15°C ~ 30°C |
| 3. | Ambient Relative Humidity | 30% ~ 60% (no condensation) |
| 4. | Vibration | Vibration may affect equipment accuracy; keep away from vibration sources |
| 5. | Power Requirements | 1. 220V ± 10% 2. Power ≤ 500W 3. Frequency: 50/60Hz |
| 6. | Grounding | Must be properly grounded. Follow local regulations for grounding specifications. |
| 7. | Voltage | 220V ± 10% |
| 8. | Frequency | 50/60Hz |
| 9. | Grounding | Must be grounded |
| 10. | Power | ≤ 500W |
| 11. | Interface Specification | 5A, Single-phase 3-wire |
Product Details
FAQs
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