What Are You Looking For?
HY-WB350PM / HY-WB350M Gold Wire Wedge Bonding Machine is designed for internal chip-to-pin interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, microwave, optoelectronic and automotive electronic devices. It supports products under 200 mm and provides stable ultrasonic output for reliable bonding performance.
Brand :
HYRNUSItem No. :
HY-WB350PM / HY-WB350MOrder(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaGold Wire Wedge Bonding Machine COB Packaging Wedge Bonder for Special Alloy Wire
Product Introduction
HY-WB350PM / HY-WB350M Gold Wire Wedge Bonding Machine is designed for internal chip-to-pin interconnection in special electronic component packaging. It is suitable for hybrid circuits, COB modules, MCMs, MEMS devices, RF and microwave modules, optoelectronic devices, military electronics and automotive electronic modules.
The machine supports devices with dimensions below 200 mm. By replacing bonding tools of different lengths, it can accommodate cavity depths of 15 mm and 21 mm. It also supports zero-tail stud bumping and features stable ultrasonic energy output and an integrated electrical control system, helping ensure consistent bonding quality and reliable operation.
Applications
Features
| No. | Feature |
| 1 | Compatible with high- and low-frequency transducers |
| 2 | High-precision closed-loop pressure control system (accuracy within 1 g) |
| 3 | Capable of zero wire tail bumping (stud bumping) function |
| 4 | One-touch switching between high and low power modes |
| 5 | Integrated electrical control system |
Main Technical Specifications
| NO | Section | Parameter | Specification | Other Parameters | |
| 1. | Bond Head | Z Travel | 18 mm | Spool Size | 1/2 inch |
| 2. | X-Y Range | X: 15 mm, Y: 15 mm | |||
| 3. | Lift Table | Z Travel | 0~18 mm | Heater Temperature | Room temperature ~ 200°C |
| 4. | X-Y Range | 250 mm × 270 mm | Operation Menu | 7" TFT touch screen, Chinese menu | |
| 5. | Ultrasonic Power | Digitally controlled, 1000x subdivision | Power Supply | 220V ± 10% @ 50/60Hz, ≤500W | |
| 6. | Bonding Force | 1~250 g | Footprint (W×D×H) | ≤620 × 640 × 450 mm | |
| 7. | Wire Types |
HY-WB350PM: Gold wire 15~75 μm,,Aluminum wire 18~100 μm，Gold ribbon 12.7×50 ~ 25.4×300 μm, special alloy wire HY-WB350M: Gold wire 15~75 μm, Platinum wire 18~25 μm, Aluminum wire 18~100 μm |
Weight | Gross: approx. 70 kg; Net: approx. 45 kg | |
| 8. | Standard Configuration | Main unit, 1/2 inch spool, LED lighting, stereo microscope, workholder, 90° wire feeder | |||
Terms of use
| No | Item | Requirements |
| 1. | Parameter | Specification |
| 2. | Ambient Temperature (Room Temperature) | 15°C ~ 30°C |
| 3. | Ambient Relative Humidity | 30% ~ 60% (no condensation) |
| 4. | Vibration | Vibration may affect equipment accuracy; keep away from vibration sources |
| 5. | Power Requirements | 1. 220V ± 10% 2. Power ≤ 500W 3. Frequency: 50/60Hz |
| 6. | Grounding | Must be properly grounded. Follow local regulations for grounding specifications. |
| 7. | Voltage | 220V ± 10% |
| 8. | Frequency | 50/60Hz |
| 9. | Grounding | Must be grounded |
| 10. | Power | ≤ 500W |
| 11. | Interface Specification | 5A, Single-phase 3-wire |
Product Details
HY-WB250M / HY-WB250PM Ball Wedge Bonding Machine is designed for internal wire interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, optoelectronic, microwave and automotive electronic devices. It supports products under 200 mm, accommodates different cavity depths and provides stable ultrasonic output for reliable bonding performance.
HY-BW830 Wire Bonder is an aluminum wire bonding system designed for power module assembly, primarily used for lead connection between batteries and bus bars, supporting aluminum wire diameters of 125–500 μm.
HY-HW3741A Automatic Ultrasonic Heavy Aluminum Wire Wedge Bonder features a rotary bonding head, automatic digital frequency tracking, precise pressure control, advanced image recognition, and closed-loop motion control.
HY-HW3850 Automatic Ultrasonic Heavy Aluminum Wire Wedge Bonder is designed for high-efficiency wire bonding of power semiconductor packages such as TO-220, TO-247, TO-252, TO-251 and TO-263. Featuring dual bonding heads, PR visual positioning and automatic loading and unloading, it supports aluminum wire diameters from 125 to 500 μm, delivering accurate, stable and consistent bonding for mass production.
HY-HW3200 Ultrasonic Heavy Aluminum Wire Wedge Bonder is designed for internal wire bonding of power semiconductor devices such as MOSFETs, high-power transistors, diodes, thyristors and power modules. It features precise motion control, adjustable bonding parameters, stable ultrasonic output and support for 1–6 bonding points, ensuring reliable bonding quality and efficient operation.
HY-WB300 Wire Bonding Machine is a high-precision fully automatic wire bonding system designed for advanced semiconductor packaging, supporting SOT, SOP, MEMS, DFN, QFN, SiP, and various package forms with compatibility for gold, copper, silver, palladium-plated copper, alloy wires, and more.
HY-WB200 Wire Bonder is a high-precision automatic wire bonding system supporting SOT, SOP, MEMS, DFN, QFN, SiP, and various package forms, compatible with gold, copper, silver, and alloy wires.
HY-RW4000 Precision Semiconductor Wire Re-bonding Machine is specialized machinery designed specifically for PCB (printed circuit board) manufacturers to re-bonding circuit boards.
leave a message
Scan To Wechat :
Scan To WhatsApp :
