Trim and Form Machine

This HY-TFC100 Semiconductor Trim and Form Machine is designed for lead trimming, forming and singulation after product encapsulation. Suitable for SOP and SSOP packages, it features PLC control, servo motor drive, continuous magazine loading, automatic tube unloading and multiple safety protections, ensuring stable and efficient post-molding processing.

HY-TF200D is dedicated post-mold punching equipment for semiconductor packaging lines, integrating lead trimming, pin forming and component singulation in one automatic cycle. It supports SOT, EMC, TO, DIP and optocoupler packaging with an adjustable punching speed of 60–100 SPM. This machine is standard fitted with Mitsubishi/Yonghong PLC, servo-driven power system and complete safety protection. CCD visual inspection and MES system networking can be optionally equipped to meet intelligent digital packaging workshop demands.

HY-TFS210 Lead Cutting Machine is an automatic trim and form system specifically designed for SMA, SMB, and SMC package products. It features a simple structure with stable and reliable performance, a small footprint, fast and stable operation, low noise, and easy operation and maintenance, significantly reducing labor intensity. 

HY-TF110 Semiconductor Post Mold Equipment  is an automatic trim and form system specifically designed for SOT23-3L-20R package products.Achieving a remarkable 580K UPH with a punching stroke rate of 130 strokes per minute，maximizes throughput while maintaining tool life of 1.5 million strokes. 

HY-TF221 IC Trim and Form Machine is an automatic trim and form system specifically designed for TO220 package products.it an efficient and cost-effective Trim and Form Machine for modern semiconductor packaging lines seeking higher throughput, superior product quality, and lower operating costs.

HY-TF210 Trim Roll Former is an automatic trim and form system specifically designed for TO252-6R package products. It delivers a throughput of ≥70k per hour with a punching stroke rate of 50–60 strokes per minute, and features MTBA of ≥40 minutes, MTBF of ≥120 hours, MTTA of ≤5 minutes, and downtime rate of ≤3%.