Wire Bonder

HY-HW3741A Automatic Ultrasonic Heavy Aluminum Wire Wedge Bonder features a rotary bonding head, automatic digital frequency tracking, precise pressure control, advanced image recognition, and closed-loop motion control. 

HY-HW3850 Automatic Ultrasonic Heavy Aluminum Wire Wedge Bonder is designed for high-efficiency wire bonding of power semiconductor packages such as TO-220, TO-247, TO-252, TO-251 and TO-263. Featuring dual bonding heads, PR visual positioning and automatic loading and unloading, it supports aluminum wire diameters from 125 to 500 μm, delivering accurate, stable and consistent bonding for mass production.

HY-HW3200 Ultrasonic Heavy Aluminum Wire Wedge Bonder is designed for internal wire bonding of power semiconductor devices such as MOSFETs, high-power transistors, diodes, thyristors and power modules. It features precise motion control, adjustable bonding parameters, stable ultrasonic output and support for 1–6 bonding points, ensuring reliable bonding quality and efficient operation.

HY-WB300 Wire Bonding Machine is a high-precision fully automatic wire bonding system designed for advanced semiconductor packaging, supporting SOT, SOP, MEMS, DFN, QFN, SiP, and various package forms with compatibility for gold, copper, silver, palladium-plated copper, alloy wires, and more.

HY-WB200 Wire Bonder is a high-precision automatic wire bonding system supporting SOT, SOP, MEMS, DFN, QFN, SiP, and various package forms, compatible with gold, copper, silver, and alloy wires. 

HY-RW4000 Precision Semiconductor Wire Re-bonding Machine is specialized machinery designed specifically for PCB (printed circuit board) manufacturers to re-bonding circuit boards.