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HY-HW3741A Automatic Ultrasonic Heavy Aluminum Wire Wedge Bonder features a rotary bonding head, automatic digital frequency tracking, precise pressure control, advanced image recognition, and closed-loop motion control.
Brand :
HYRNUSItem No. :
HY-HW3741AOrder(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaUltrasonic Wire Bonder Heavy Aluminum Wedge Bonding Machine for 18650 26800 Battery Pack
Product Introduction
HY-HW3741A Automatic Ultrasonic Heavy Aluminum Wire Wedge Bonder integrates a fully automatic digital frequency tracking ultrasonic system, digitally controlled pressure regulation, high-performance image recognition unit, and fully closed-loop motion control circuit, truly realizing full automation of heavy aluminum wire bonding equipment in China.
Applications
The HY-HW3741A is mainly used for the bonding process of 18650 Tesla-type batteries, 26800 lithium batteries, IGBT fast recovery modules, automotive electronics, and other related products.Equipped with advanced image recognition and automatic positioning technology, the machine enables automatic and precise positioning of bonding sites.
Key Advantages
| No. | Advantage | Description |
| 1 | Stable & Reliable Bonding Quality | The powerful digital ultrasonic system ensures stable and reliable bonding quality. |
| 2 | Consistent High-Quality Bonds | The fully automatic frequency tracking ultrasonic system and optimized bonding head design further guarantee consistent and high quality bonds. |
| 3 | Uniform Pressure Output | The proprietary digital pressure control system maintains constant pressure output to ensure bonding uniformity. |
| 4 | High Bonding Position Accuracy | Precision mechanical transmission, reliable industrial computer, and software with independent intellectual property rights ensure high accuracy of bonding positions. |
| 5 | Fault Alarm & Improved Yield | The machine is equipped with multiple fault alarm and automatic shutdown functions, including first bond failure and abnormal wire feeding, which significantly reduce the defect rate and greatly improve production yield while enhancing operability and user friendliness. |
| 6 | Easy Operation & High Efficiency | The machine features simple and intuitive operation. New operators can master operation quickly after short-term training. A single operator can run multiple machines simultaneously, effectively improving production efficiency. |
Equipment Features
| No. | Description |
| 1 | Manual loading, automatic recognition and positioning, automatic bonding, manual unloading. |
| 2 | This assembly machine is dedicated to the bonding production of customer-specified battery products and is not a universal equipment. |
| 3 | If it is to be used for other products, modification shall be made according to actual conditions. |
| 4 | The machine mainly consists of frame assembly, XYZC feeding module, wire feeding mechanism, fixture positioning and clamping assembly, bonding head mechanism and control console. |
| 5 | X-axis adopts linear motor, Y/Z modules adopt precision ball screw drive. Positioning repeatability is less than ±0.02 mm, angular positioning accuracy is ±1°. |
| 6 | The control system adopts industrial PC + motion control card to drive servo motors. The equipment is simple in operation and maintenance, with user-friendly control interface, digital parameter setting and high flexibility. |
| 7 | Equipped with quick clamps and single-button start, making workpiece loading simple and safe for operators. |
Brief Production Flow
| No. | Description |
| 1 | The operator manually places the product on the fixture and clamps it with the quick clamp. |
| 2 | The machine is started by a single-button operation. |
| 3 | The system captures images of the fiducial marks on the product via the camera for positioning. |
| 4 | After positioning is completed, the motion mechanism drives the bonding head to perform welding. |
| 5 | After all fuses are welded, the bonding head returns to the origin. The operator manually flips the product and repeats the above steps. |
| 6 | After both sides are welded, the product is unloaded manually. |
| 7 | The cycle repeats continuously for uninterrupted production. |
Main Technical Specifications
| Item | Specification |
| Power Supply | 220VAC ±10%, 50Hz, with reliable grounding; max. power consumption approx. 1660W |
| Ultrasonic Frequency | 60 kHz |
| Ultrasonic Power | 0~24W, with automatic switching between 1st and 2nd bonds |
| X-axis | Driven by linear motor, repeat positioning accuracy up to ±0.02 mm |
| Bondable Aluminum Wire Diameter | 125~500 μm (5~20 mil) |
| Working Area | X-Y axes: Max. 300 × 300 mm (customizable upon request) |
| Z-axis travel: 70 mm; C-axis rotation: ±90° | |
| Ultrasonic Time | 10~500 ms, multi-channel control |
| Bonding Force | 50~1200 g, multi-channel control |
| Bonding Speed | Approx. 1.5 seconds per wire(Note: Actual speed depends heavily on wire diameter, travel distance between cells, and material bondability.) |
| Bonding Angle | ±90° |
| Vision System | PR microscope with 0.5x magnification |
| PR Illumination | White light with adjustable brightness |
| Overall Dimensions (L×W×H) | Approx. 800 × 1000 × 1650 mm |
| Weight | Approx. 650 kg |
Product Details
HY-WB250M / HY-WB250PM Ball Wedge Bonding Machine is designed for internal wire interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, optoelectronic, microwave and automotive electronic devices. It supports products under 200 mm, accommodates different cavity depths and provides stable ultrasonic output for reliable bonding performance.
HY-BW830 Wire Bonder is an aluminum wire bonding system designed for power module assembly, primarily used for lead connection between batteries and bus bars, supporting aluminum wire diameters of 125–500 μm.
HY-HW3850 Automatic Ultrasonic Heavy Aluminum Wire Wedge Bonder is designed for high-efficiency wire bonding of power semiconductor packages such as TO-220, TO-247, TO-252, TO-251 and TO-263. Featuring dual bonding heads, PR visual positioning and automatic loading and unloading, it supports aluminum wire diameters from 125 to 500 μm, delivering accurate, stable and consistent bonding for mass production.
HY-HW3200 Ultrasonic Heavy Aluminum Wire Wedge Bonder is designed for internal wire bonding of power semiconductor devices such as MOSFETs, high-power transistors, diodes, thyristors and power modules. It features precise motion control, adjustable bonding parameters, stable ultrasonic output and support for 1–6 bonding points, ensuring reliable bonding quality and efficient operation.
HY-WB300 Wire Bonding Machine is a high-precision fully automatic wire bonding system designed for advanced semiconductor packaging, supporting SOT, SOP, MEMS, DFN, QFN, SiP, and various package forms with compatibility for gold, copper, silver, palladium-plated copper, alloy wires, and more.
HY-WB200 Wire Bonder is a high-precision automatic wire bonding system supporting SOT, SOP, MEMS, DFN, QFN, SiP, and various package forms, compatible with gold, copper, silver, and alloy wires.
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