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HY-CS900 Semiconductor Handler Automated Test and Sorting Equipment for Process Automation.
Brand :
HYRNUSItem No. :
HY-CS900Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaAutomatic KGD Test & Sorting Machine For Process Automation
Product Introduction
HY-CS900 Test & Sorting Machine Centered on core strengths of high-temperature compatibility, precision screening, high-volume production efficiency, and cost control, the equipment covers die-level visual defect inspection, electrical performance testing, and finished product packaging. It helps eliminate defective bare dies before packaging, improving post-packaging yield and delivery efficiency.
Key Capabilities & Benefits
Application Scenarios
Including but not limited to KGD (Known Good Die) testing of SiC bare dies. Please contact us for special requirements.
Equipment Features
Die-level testing and sorting for power chips; suitable for SiC and other high-power, high-reliability, high-performance devices.
Supports reliability characterization: UIS up to 3 kV, SC up to 3000 A.
Supports static testing up to 3 kV / 600 A (voltage / current).
Supports dynamic testing up to 2 kV / 1500 A (voltage / current).
Innovative handler and tester architecture for higher efficiency; comprehensive UPH up to 4K (depending on customer requirements and test content).
Low stray inductance and low contact resistance ensure clean, reliable signals for improved test accuracy: - Test loop stray inductance: < 50 nH - Die contact resistance: < 10 mΩ
Test environment protected by nitrogen-based inert atmosphere (at room/high temperature) to prevent arcing. - High-temperature test environment: up to 175°C ± 2°C
Technical Specifications
| Item | Specification |
| Name | KGD Test & Sorting Machine |
| Supported Products | SiC bare die |
| Input Formats | Wafer (6/8/12-inch), Tape & Reel, custom Tray |
| Chip Size Range | 2mm×2mm – 8mm×8mm |
| Chip Thickness | 80µm – 600µm |
| Index Time | < 700ms (Parallel with Test) |
| Test Loop Stray Inductance (Dual Die) | < 50 nH |
| Contact Resistance | < 10 mΩ |
| Multi-Site Parallel Testing | Supported |
| Main Test Items | Dynamic, Static, UIS, SC, etc. |
| Test Environment | Ambient / High Temperature |
| Temperature Range | Ambient to 200°C |
| Temperature Stability | ±2°C @ 3σ, Resolution 0.1°C |
| Product Protection | Nitrogen atmosphere protection |
| Placement Position Accuracy | ±25µm @ 3σ |
| Placement Angular Accuracy | ±0.5° @ 3σ |
| Equipment Dimensions | 3100mm (L) × 1400mm (W) × 1900mm (H) |
Product Details
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