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High Precision Series Wafer Level Sorting Machine

HY-WS600 Chip Sorting Machine integrates wafer-level inspection, high-precision sorting, automated loading/unloading, and data traceability in a single system. 

  • Brand :

    HYRNUS
  • Item No. :

    HY-WS600A
  • Order(MOQ) :

    1 Set
  • Warranty :

    One-Year Warranty and Lifetime Maintenance
  • Payment :

    T/T
  • Lead Time :

    7-35 Days
  • Product Origin :

    China
  • High Precision Series Wafer Level Sorting Machine

     

    Product Introduction

    HY-WS600 Series Sorting Machine enables "precision sorting, high-efficiency mass production, and cost control" in advanced packaging processes, making it one of the core domestic alternatives for semiconductor back-end packaging equipment. It fills the critical wafer-level processing segment in the test and sorting product line, completing the full industrial chain solution for semiconductor back-end processes.It supports 6-inch, 8-inch, and 12-inch wafers, as well as full-size die ranging from 0.5×0.5 mm to 15×15 mm, covering a wide range of devices including SiC, IGBT, CIS, and MEMS.

    Key Capabilities & Benefits

    The test and sorting product line covers over 95% of chip test and sorting scenarios, meeting the requirements for consumer-grade, industrial-grade, and automotive-grade chips. Featuring a fully automated closed-loop process, it improves inspection efficiency by 60% and achieves 99.9% yield control, empowering enterprises to reduce costs and increase efficiency.It delivers precise sorting and classification with ±25 μm accuracy, high flexibility, and 10 μm minimum defect detection capability during the semiconductor packaging process.

    sorting machine

    Application Scenarios

    Photoelectric performance testing of light-sensing chips, TOF chips, and other related devices, as well as long-duration burn-in/testing of chips.

    Technical Specifications
    Item Specification
    Model HY-WS600A HY-WS601A
    Incoming Form 6/8/12-inch Wafer, Tray, Tape & Reel
    Die Size 0.5×0.5mm ~ 15×15mm
    Die Thickness ≥ 80 μm
    UPH ≥ 20K ≥ 5K
    Output BIN Count Single BIN Multi-BIN (Max. 6 BINs)
    Output Format 6/8/12-inch Wafer / Tray / Tape & Reel Tray / Tape & Reel
    Force Control Range 50g (0.5N) ~ 1000g (10N)
    Force Control Accuracy ≤ ±10%
    Placement Position Accuracy ±25 μm @ 3σ
    Placement Angular Accuracy ±0.5° @ 3σ
    Front & Back Side Inspection Detection precision: >10 μm, detectable with contrast ≥30;
    Defect types: Scratches, stains, foreign matter, die cracks, chipped dots, chipped edges, etc.
    Equipment Dimensions 1500mm (L) × 1500mm (W) × 1900mm (H) 2400mm (L) × 2300mm (W) × 1900mm (H)

    Product Details

    sorting machine

     

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Contact us:allen@hyrnus.com