Fully Automated Light-Sensitive Chip Final Test Sorter

HY-CS800 Sorter is Fully Automated High-Precision Sorting Equipment for the Final Test (FT) Stage

Brand :
HYRNUS
Item No. :
HY-CS800
Order(MOQ) :
1 Set
Warranty :
One-Year Warranty and Lifetime Maintenance
Payment :
T/T
Lead Time :
7-35 Days
Product Origin :
China

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Fully Automated Light-Sensitive Chip Final Test Sorter

Product Introduction

HY-CS800 Chip Final Test Sorter suitable for Image Sensor Chip Packaging Covering all categories of optical sensor devices including CIS, TOF, LiDAR chips, and miniature optical sensors, the equipment integrates optical performance testing, electrical performance inspection, appearance defect screening, automated sorting, and finished product packaging into one system. It is capable of supporting devices with long test times, such as image sensors and TOF chips.

Key Capabilities & Benefits

Centered on the core values of "high precision, high efficiency, high compatibility, and low loss", it meets the mass production requirements of consumer electronics, automotive electronics, optical communications and other fields. It supports UPH ≥ 9K for devices with test time ≤ 9s, while also accommodating image sensors, TOF chips, and other products with longer test times. It helps customers achieve quality control and efficient sorting in the FT stage of image sensor chips, eliminate defective products, improve delivery yield, and reduce labor and manufacturing costs. It is a core enabling equipment for the back-end packaging and testing process of image sensor chips.

Application Scenarios

Including but not limited to optoelectronic testing for image sensors, TOF chips, and devices with long test times. Please contact us for special requirements.

Technical Specifications

Item	Specification
Name	Image Sensor Chip FT Sorting Machine
Supported Packages	QFN / LGA / SOP / QFP / SOT and other packaged chips
Input Formats	Bulk, Tube, Tray, Tape & Reel
Output Format	Tape & Reel
Chip Size Range	1×0.5mm – 8×8mm
Equipment UPH	≥ 9K (when test time ≤ 9s)
Main Test Items	For image sensor chips: PS, CT, ALS, etc. Customizable for other chips based on actual requirements
Test Stations	Up to 64 sites
Number of Testers	1 unit
Placement Position Accuracy	±25µm @ 3σ
Placement Angular Accuracy	±0.5° @ 3σ
Top/Bottom Side Inspection	Detection resolution >10µm; detectable with contrast >30. Defect types: scratches, stains, foreign particles, burn marks, chipped corners, chipped edges, etc.
Equipment Dimensions	3100mm (L) × 1800mm (W) × 2000mm (H)