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Chip Capacitor Test & Sorting Machine for Visual Defect Inspection

HY-CS3021 Chip Sorter is designed for visual defect inspection, electrical performance testing, and finished product packaging of miniature active and passive components.

  • Brand :

    HYRNUS
  • Item No. :

    HY-CS3021
  • Order(MOQ) :

    1 Set
  • Warranty :

    One-Year Warranty and Lifetime Maintenance
  • Payment :

    T/T
  • Lead Time :

    7-35 Days
  • Product Origin :

    China
  • Chip Capacitor Test & Sorting Machine for Visual Defect Inspection

    Product Introduction

    HY-CS3021 Test & Sorting Machine specializes in these functions for chip capacitors, including SLC, array capacitors, MLC, silicon capacitors and other types. It meets the high-precision, high-compatibility and intelligent requirements for large-scale production of miniature semiconductor components, and is key equipment to improve the outgoing quality and production efficiency of chip capacitors.

    Key Capabilities & Benefits

    HY-CS3021 Test & Sorting Machine adopts a full modular architecture with freely configurable structure and modular wearing parts, supporting quick changeover and adaptation to multi-specification product switching. Integrating traditional mature algorithms with AI inspection technology and CCD auto-focusing, it achieves recognition accuracy ≥5μm, supports 2-sided / 6-sided appearance inspection, and accurately detects defects such as electrode oxidation, scratches and corner chipping.

    sorting machine

    Application Scenarios

    Single-layer chip capacitors (SLC)

    Multi-layer chip capacitors (MLC/MLCC)

    Silicon capacitors

    RC networks

    Array chip capacitors

    Technical Specifications

    Item Specification
    Model HY-CS3021
    Product Size 0.2mm × 0.2mm ~ 10mm × 10mm
    Input Formats Bulk / Wafer
    Output Formats Waffle Pack / Gel-Pak / Wafer
    Equipment UPH ≥ 5K (test time ≤ 200 ms)
    Main Test Items Capacitance, Dissipation Factor, Insulation Resistance, Withstand Voltage
    Waffle Pack Placement Accuracy Single-side spacing ≥ 0.03 mm; placement success rate > 96%
    Blue Tape Placement Accuracy ±25 µm; ±1°
    Visual Inspection Inspection accuracy > 5 µm; detectable at contrast > 30Detectable defects: scratches, wear, missing plating, excess plating, curling, peeling, dents, indentations, discoloration, contamination, chipping, electrode position offset, etc.
    Equipment Dimensions 1500 mm (L) × 1300 mm (W) × 1900 mm (H)

    Product Details

    chip sorter machinechip sorterwafer sortersemiconductor handler

    chip sorter

     

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If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.

leave a message

leave a message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact us:allen@hyrnus.com