High Performance Blue Tape Taping Machine for IC and LED Devices

High Performance Blue Tape Taping Machine for IC and LED Devices

Product Introduction

HY-BT12 sorting machine features a 180° rotary arm with cam-driven Z-axis and AC servo motors, delivering a taping cycle time of <300 ms (camera off) or <450 ms (camera on) with a maximum UPH of 15K. The system supports wafer sizes of 8" and 12" with expansion rings and handles die sizes from 5 × 5 mil to 270 × 270 mil, compatible with 8 mm and 12 mm carrier tapes. Equipped with a 1024 × 768 pixel vision system offering 256 grayscale levels and 0.7× to 4.5× optical magnification, it delivers recognition accuracy of 1.56 μm to 8.93 μm and placement accuracy of 35 μm. The bottom camera detects chipped die, cracked die, and die orientation, with programmable bonding force of 40–200 gf and an ejector system with programmable up/down motion. The system includes comprehensive mapping functionality with color-coded classification (Good/Bad/Other/Empty), supports Horng Com TXT map format, and features vacuum sensor missing die detection. Operating on AC 220V / 50Hz with rated power of 2500 W, requiring compressed air of ≥0.6 MPa and vacuum of 700 mmHg, the HY-BT12 measures 1200 × 1200 × 1500 mm and weighs 1000 kg, delivering efficient, reliable operation for high-volume blue tape to carrier tape packaging.

Technical Specifications

Item	Specification
Pick & Place Unit
Rotary Arm	180° rotating type
Z-Axis	Cam structure
Motor	AC servo motor
Z-Axis Signal Cable	Optimize cable routing to prevent wire/tube twisting or breakage
Wafer Stage
X-Y Travel	14" × 14"
X-Y Stage Resolution	0.04 mil (1 μm)
Motor	Linear motor
Taping Unit
Carrier Tape Specification	Compatible with 8 mm and 12 mm carrier tapes
Bottom Camera	Detects chipped die, cracked die, and die orientation (front/back)
Die & Wafer
Die Size	5 mil × 5 mil ~ 80 mil × 80 mil80 mil × 80 mil ~ 270 mil × 270 mil
Wafer Size	8" / 12" (with expansion rings)
Die Type	IC, LED
Bonding Force	40 gf ~ 200 gf (programmable)
Ejector System
Ejector Pin & Ring Movement	Programmable up/down motion
Vision & Optical System
Image Processing	256 grayscale levels
Detection Capability	Ink dots, chipped die, cracked die (auto skip)
Resolution	1024 × 768
Optical Magnification	0.7× ~ 4.5× adjustable
Recognition Accuracy	1.56 μm ~ 8.93 μm
Die Placement Accuracy	35 μm (for 5 mil ~ 80 mil)
CPK	Configurable alarm limits
Wafer Optical Magnification	Two lens sets for different die sizes, user selectable
Bottom Camera Magnification	Two lens sets for different die sizes, user selectable
Speed
Taping Cycle Time	<300 ms (camera OFF)<450 ms (camera ON)
Program Storage
Program Quantity	50
Max Dies per Substrate	999 × 999
Max Substrates per Run	99 × 99
Missing Die Detection
Detection Method	Vacuum sensor
Utilities
Power Supply	AC 220V / 50Hz
Compressed Air	≥ 0.6 MPa
Vacuum Level	700 mmHg
Power Consumption	2500 W
Dimensions & Weight
Weight	1000 kg
Machine Size	1200 × 1200 × 1500 mm
Software & Appearance
Branding	No company name/logo on machine
Software Logo	H-Com logo integrated
Machine Color	JAL standard (W-900 M-12 N-0.6 B-0.7 I-0.6)
Mapping Function
Die Classification	Good / Bad / Other / Empty (color-coded)
File Format	Compatible with Horng Com TXT map
Mapping Function	All dies individually aligned, inspected, and recorded

Application Scenarios

Blue tape tape-and-reel machine is designed to precisely pick chips from blue tape wafers and load them into carrier tapes. It supports 12-inch wafers with backward compatibility for 8-inch wafers, enabling multi-sided bottom defect inspection of chips. The machine supports both self-adhesive and heat-sealing tape encapsulation with adjustable peel strength and precise cover tape counting. Featuring stable rail clamping and easy adjustment, it delivers a maximum UPH of 15K, offering efficient and reliable operation for mass production.Its core application is to automatically pick chips from blue tape wafers and package them into carrier tape reels for customers.

Product Details