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1

High-Speed Series Test & Taping Integrated Machine

HY-TT1801 Test Sorter is applied to taping of discrete devices, ICs, DFN components and rectifier bridges. 

  • Brand :

    HYRNUS
  • Item No. :

    HY-TT1801
  • Order(MOQ) :

    1 Set
  • Warranty :

    One-Year Warranty and Lifetime Maintenance
  • Payment :

    T/T
  • Lead Time :

    7-35 Days
  • Product Origin :

    China
  • High-Speed Series Test & Taping Integrated Machine

     

    Product Introduction

    HY-TT1801 Turret Type Test Sorter integrates high-speed testing, marking and taping functions. Equipped with Japan imported DD motors, the equipment ensures stable operation and high UPH. Combined with integrated marking and vision systems, it delivers high-quality taping output for customers.

    Hardware System

    Self-developed motors

    In-house designed test circuit boards

    Optimized structure with enhanced precision

    High speed and high efficiency

    Maximum throughput up to 55K/H

    Multi-functional design suitable for cross-industry applications

    Vision System

    The vision system supports multiple configuration options.

    Compatible with various product sizes: 1.0×1.0, 3.5×3.5, 4×4, and 6×6 mm.

    Visual recognition technology is independently developed in-house.

    Equipment Features

    Automatic height calibration function

    Automatic feeding: Vibratory bowl feeder for fast and stable material supply

    Testing: Equipped with 2–8 electrical test stations and 4 CCD inspection stations for efficient orientation verification, optical inspection, and electrical performance testing, greatly improving yield rate

    Main turret: 18 or 24 servo-driven vacuum nozzles to precisely transfer products to each station center

    Rotation unit: High-precision positioning and product orientation adjustment with a positioning error of 0.005 mm and angular accuracy of 0.1°

    Marking turret: Integrated with laser marking, dust extraction, and marking vision inspection to significantly improve marking speed

    Taping module: Supports automatic taping with an additional automatic material replenishment function

    Key Technical Specifications

    HY-TT1801 Series Specifications
    System Function
    Throughput (UPH) Max. 55,000 UPH (varies based on product size and test time)
    Positioning Accuracy ±5 µm
    Directional Accuracy ±0.1°
    Applicable Package Types SOT, SOD, SC, SON, SOP, BGA, OIC, TSSOP, MSOP, QFN, DFN, WLCSP, Magnetic Sensor, Optical Sensor, Proximity Sensor, etc.
    Device Configuration
    Feeding Method Vibrating disc / Tube
    Discharging Method Carrier Tape / Tube
    Optical Inspection Yes
    Laser Marking Yes
    Test Base Stations 2~8 stations
    Image Recognition System
    Grayscale Levels 256-level gray scale
    Resolution 480 × 640 pixels
    Recognition Accuracy Pixel accuracy: PA 0.01; Recognition accuracy: RA 0.02-0.03
    Electrical Parameters
    Voltage / Frequency 220V AC ±5% / 50 Hz
    Rated Power 800~1500 W
    Pressurized Air Requirement 0.5 MPa (minimum)
    Air Consumption 50 L/min
    Mechanical Dimensions
    Dimensions (L × W × H) L 1470 × W 1340 × H 2020 mm
    Weight 800 kg

    Customer Application Cases(Sorting Machine Operation)

    die bonder

    Product Details

    chip sorter machine

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If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact us:allen@hyrnus.com