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HY-WC615 double-side wafer chamfering machine is equipped with CCD vision positioning & online thickness measurement modules, self-developed core mechanical components and full auto loading/unloading system, delivering outstanding machining precision and user-friendly touch operation for wafer chamfer processing.
Brand :
HYRNUSItem No. :
HY-WC615Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaFull-automatic High-precision Double-Side Wafer Chamfering Machine for 4/6/8 Inch Silicon Wafers
Product Introduction
HY-WC615 full-automatic high-precision double-side wafer chamfering machine supports double-side chamfering for 4/6/8-inch silicon wafers with 0.4–1.5mm thickness. It stores multi-stage programs for switchable rough and finish chamfering to fit diverse process demands. Fitted with CCD vision positioning and online thickness measurement modules, the machine features self-developed core spindles and detection systems, plus automatic loading/unloading and reject unloading stations. Equipped with intuitive touch LCD panel, it maintains stable machining precision for precision semiconductor wafer chamfering.
Product Advantages
1. The wafer chamfering unit adopts the side-feed grinding principle, compatible with chamfering processing of Ø4'' / Ø6'' / Ø8'' (Φ100~Φ200) wafers.
2. Equipped with precision online thickness measuring unit and CCD vision module, the machine measures wafer thickness and precisely locates wafer center to accurately control chamfering angle during machining.
3. After processing, it automatically inspects multiple key parameters including wafer diameter, roundness, straight edge-to-center offset and chamfer edge dimension to guarantee consistent machining accuracy.
4. Features multi-stage chamfering programs, as well as rough and fine grinding chamfering functions, which can meet various process requirements of wafer processing.
5. The core grinding spindle, wafer holding spindle, vision positioning system and thickness measurement system are all independently researched, developed and manufactured by our company.
6. With full-automatic loading and unloading station and defective product unloading station, it supports double-side chamfering processing of wafers with a thickness of 0.4mm to 1.5mm.
7. Configured with a touch-type LCD monitor for improved operational convenience. The control screen synchronously displays processing and equipment status, and operators can complete all operations easily by touching the buttons on the screen.
Technical Parameter
| Parameter Name | Unit | HY-WC615 | |
| Wafer Size | in | Compatible with Ø4"/Ø6" | |
| Grinding Method | - | Wafer Rotary Feed Grinding | |
| Wheel Diameter | mm | Ø205 Diamond Grinding Wheel | |
| Spindle | Rated Power | KW | 1 |
| Rated Speed Range | RPM | 500~3000 | |
| Notch Spindle | Rated Power | KW | - |
| Rated Speed Range | RPM | - | |
| Product & Grinding Table Positioning Accuracy | um | ±4 | |
| Thickness Measurement Repeatability | um | ±2 | |
| Grinding Accuracy | Diameter Control Accuracy | um | 15 |
| Wafer Roundness Control Capability | um | ＜10 | |
| Chamfer Face Width Accuracy | um | ＜20 | |
| Flat/Secondary Flat Edge Angle Control Capability | Degree | ±0.05 | |
| Equipment Dimension (W × D × H) | mm | 2000×1150×1950 | |
| Equipment Weight | KG | Approx. 1000 | |
Product Details
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