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HY-IS1000 is dual-station SiC ingot laser slicing and grinding equipment combining laser modification and wafer delamination processes. It uses ultra-short pulse laser to form internal modified layers inside SiC ingots for saw-mark-free wafer splitting, delivering high throughput with ground wafer TTV ≤1.1 μm. It is essential mass-production equipment for third-generation semiconductor substrate manufacturing.
Brand :
HYRNUSItem No. :
HY-IS1000Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaSiC Ingot Laser Stealth Slicing and Grinding Machine for 6/8/12 Inch Wafers
Product Introduction
HY-IS1000 SiC Ingot Laser Stealth Slicing and Grinding Machine is two-station SiC ingot laser slicing and grinding equipment that integrates a laser modification station and a wafer delamination station. At the laser modification station, an ultra-short pulse laser with wafer-matched transmission wavelength is focused to a designated internal depth of the ingot via a high-precision optical system to trigger multi-photon absorption, break material chemical bonds and create a modified layer with high dislocation density zones. After modification, the wafer delamination station carries out delamination along preset crystal fracture planes to realize saw-mark-free wafer separation from the ingot. Boasting high processing efficiency (single 8-inch wafer processed within 25 minutes) and ground surface TTV no more than 1.1 μm, this machine serves as vital manufacturing machinery for mass production of third-generation semiconductor substrates.
Machine Structure Diagram
Machine Operation Process
| No. | Operation Steps |
| 1 | Place SiC ingot at loading station |
| 2 | Perform ingot measurement |
| 3 | Transfer ingot to laser modification platform |
| 4 | Laser modification processing |
| 5 | Robotic arm picks up the ingot |
| 6 | Conduct secondary ingot measurement |
| 7 | Transfer mechanism absorbs the ingot |
| 8 | Transfer to delamination platform for wafer separation |
| 9 | Transfer ingot to turnover station for bottom surface cleaning |
| 10 | Transfer ingot to cleaning station for top surface cleaning and spin drying |
| 11 | Place the ingot at unloading station |
| 12 | Transfer separated wafer to turnover station for bottom surface cleaning |
| 13 | Transfer wafer to cleaning station for top surface cleaning and spin drying |
| 14 | Place the wafer at unloading station |
Specifications
1. Inspection Standards
| Parameter | X-axis | Y-axis | Z-axis | Measuring Instrument |
| Straightness | 1 μm/100 mm | 1 μm/100 mm | — | Autocollimator |
| Flatness | 1 μm/210 mm | 1 μm/210 mm | — | Autocollimator |
| Orthogonality | 5 μm @ XY Axes | — | — | Ceramic Square Ruler |
| Repeatability | ±1 μm | ±2 μm | ±1 μm | Laser Interferometer |
| Positioning Accuracy | ±2 μm | ±3 μm | ±2 μm | Laser Interferometer |
| Load Capacity | 5 kg | X+5 kg | 10 kg | Standard Weights |
2. Advantages and Features
| Parameter | Specification |
| Ingot Diameter | Compatible with 6/8/12-inch |
| Ingot Thickness | ≤50 mm (customizable) |
| Slicing Thickness | Supports standard thicknesses of 150/700 μm (customizable) |
| Single Line Throughput | UPH ≥ 3 |
| Laser Cutting Accuracy | Repeat accuracy ≤ ±1 μm, Positioning accuracy ≤ ±2 μm |
| Separated Wafer Thickness | ≤500 μm |
3. Accuracy Specifications
| Section Name | Parameter Item | X-axis | Y-axis | Z-axis | Specification |
| Modification Station – Mechanical Geometric Accuracy | Straightness | 1 μm/100 mm | 1 μm/100 mm | — | — |
| Flatness | 1 μm/210 mm | 1 μm/210 mm | — | — | |
| Orthogonality | — | — | — | 5 μm @ XY axes | |
| Modification Station – Static Performance | Repeatability | ±1 μm | ±2 μm | ±1 μm | — |
| Positioning Accuracy | ±2 μm | ±3 μm | ±2 μm | — | |
| Load Capacity | 5 kg | X+5 kg | 10 kg | — | |
| Separation Station – Servo Module | Axis Repeatability | — | — | — | ≤ ±0.02 mm |
| Separation Station – Ball Screw | Axis Repeatability | — | — | — | ≤ ±0.02 mm |
| Separation Station – Pick & Place Accuracy | XY Position Accuracy | — | — | — | ±0.02 mm |
| Angular Accuracy | — | — | — | ±0.1° |
Main Frame
| Category | Components & Specifications |
| Modification Station Scope | Granite base, linear motor air-bearing Y-axis, linear motor air-bearing X-axis, servo motor Z-axis, servo motor transfer axis, axis drive controller, transportation packaging & insurance |
| Separation Station Scope | 1. Frame Upper/Lower Frame: Welded frame main body + sheet metal cladding |
| 2. Cover Plates Top cover plate: Cold rolled steel sheet with plastic spraying surface (Standard Configuration) Bottom cover plate: Cold rolled steel sheet with plastic spraying surface (Standard Configuration) |
|
| 3. Structural Parts 45# steel with chromium plating & aluminum alloy with anodic oxidation |
|
| 4. Power Supply Single-phase 220V, 80A |
|
| 5. Air Source ≥0.5 MPa, 150 L/min |
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Product Details
HY-WD1201 accommodates max Φ300mm workpieces with 310mm X/Y travel for 8–12 inch frames. Equipped with rigid anti-vibration structure, 0.003mm Y-axis positioning accuracy and 380° θ-axis rotation, it carries a 10000–60000rpm spindle compatible with Φ58mm blades. Standard with blade inspection, auto sharpening, 15-inch touch control and GEM communication, this 115010201750mm/1000KG machine realizes precision cutting for silicon wafers, SiC, ceramics, optical glass and magnetic materials.
HY-WD801 handles max Φ210mm workpieces with 220mm X/Y travel for 6–8 inch framed wafers. It shares identical motion accuracy, spindle performance, blade protection and control system with HY-WD1201, supporting 0.1–1000mm/s feed, 10000–60000rpm spindle speed and Φ58mm max blades. Compact (10208901750mm, 800KG) with small footprint, it is designed for small & medium-batch precision dicing of wafers, optical components and ceramic substrates.
HY-PD1202 fits large 300×300mm frames. Full closed-loop Y control keeps 0.005mm accuracy across 310mm travel, Z repeat precision stays 0.003mm. Equipped with non-contact height detection, dual-light vision, blade inspection and heavy-duty spindles. Optimized spindle layout and large square tray raise efficiency by 5%; centralized lubrication ensures long-term precision, fully GEM-compatible for mass-production automation lines.
HY-PD802 supports max 210×210mm frames. Full closed-loop Y grating scale delivers 0.005mm accuracy within 220mm travel, Z-axis repeat precision hits 0.003mm. Fitted with non-contact blade height sensor, dual-light vision, blade break detection and imported dual spindles. Compact low-noise unit with 15-inch touchscreen supports batch cutting, auto alignment and breakpoint resume, compatible with GEM protocol for semi-auto lines.
HY-PD801 is an 8-inch semi-automatic single spindle tape dicing saw with max 210×210mm workpiece size. Its rigid frame and upgraded X-axis boost efficiency by 5%. Equipped with square frames, touch screen, proprietary cutting algorithm, auto blade preset and blade break detection, it delivers stable precision and easy maintenance, and supports GEM protocol for automatic factory integration.
HY-PD1201 is a multi-functional tape dicing saw supporting up to 12-inch workpieces. The Y-axis features full closed-loop grating scale control for superior positioning accuracy. It comes standard with NCS non-contact height measurement, coaxial & ring dual-light vision system and imported high-speed spindle. Compact, low-noise and user-friendly, it delivers precision cutting for all hard brittle materials with full functions including multi-sheet cutting, auto image recognition and resume cutting after breakpoints.
HY-WD601 is designed for 6-inch semiconductor and hard brittle workpieces. Fitted with an imported high-speed spindle and Y-axis grating closed-loop control, it delivers ultra-precise cutting performance. Equipped with coaxial & ring light vision, NCS height measurement and BBD blade detection, it meets multi-material precision cutting demands across semiconductor packaging, optoelectronics and new energy industries. It features touchscreen operation, full safety protection and multiple intelligent cutting modes.
HY-WT9330 is equipped with one air-bearing grinding spindle and two air-bearing workpiece spindles. It can process various ultra-hard, brittle and hard-to-grind substrates up to 12 inches, enabling high-efficiency, damage-free and ultra-precise mirror grinding with outstanding thickness accuracy, suitable for the back thinning process of all types of chip wafers.
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