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HY-WT9530 is fitted with 2 air-bearing spindles and 3 vacuum chuck tables for hard brittle substrates up to 8-inch. Operators only need to load cassettes manually, while the machine completes full automatic cycles including rough/fine grinding, cleaning and recovery. Post-grinding TTV≤1.5μm with excellent flatness and surface roughness, suitable for backside thinning of various semiconductor wafers.
Brand :
HYRNUSItem No. :
HY-WT9530Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaFully Automatic Wafer Grinder with Air-Bearing Spindle and Chuck Table
Product Introduction
HY-WT9530 Fully Automatic Wafer Grinder is equipped with two 9.5kW air-bearing grinding spindles, three workpiece air-bearing spindles and porous vacuum chuck tables, processing hard brittle substrates up to 8-inch, while its maximum mechanical workpiece capacity reaches Ø300mm. Operators only need to load cassettes manually; multiple robotic arms automatically finish positioning, rough grinding, fine grinding, spin cleaning and unloading for continuous unmanned production. The grinding Z-axis has a 120mm travel with a minimum feed of 0.1μm for stable thickness control. Post-grinding wafer TTV≤1.5μm, inter-wafer thickness deviation ±3μm, and surface roughness Ra＜10nm, delivering outstanding flatness and surface finish for backside thinning of various semiconductor wafers.
Product Application
The machine processes substrates up to Ø300mm mechanically, and handles ultra-hard brittle materials including SiC, LN, LT and sapphire within 8-inch. It is widely adopted for precision backside thinning of semiconductor wafers, catering to mass production of wide bandgap semiconductors and optoelectronic materials.
Machine Structure Diagram
Machine Operation Process
| Step | Operation Steps |
| 1 | Manually load wafers into the cassette |
| 2 | The robotic arm takes wafers from the cassette and transfers them to the alignment stage |
| 3 | Arm T1 absorbs wafers from the alignment stage and places them on the chuck table |
| 4 | Wafers undergo Z2 rough grinding and Z1 fine grinding; Arm T2 transfers wafers from the chuck table to the spin cleaning station |
| 5 | The robotic arm picks up wafers from the spin cleaning station and puts them back into the cassette to repeat the whole process |
Specifications
| No. | Item | Parameter |
| 1 | Max Workpiece Size | Ø300 mm |
| 2 | Air-bearing Grinding Spindle | Quantity: 2 |
| Power: 9.5 kW | ||
| Speed: 1000~4000 r/min | ||
| 3 | Workpiece Air-bearing Spindle | Quantity: 3 |
| Speed: 10~300 r/min | ||
| 4 | Grinding Z-Axis | Travel: 120 mm |
| Grinding Feed Rate: 0.0001~0.08 mm/s | ||
| Minimum Feed Step: 0.1μm | ||
| 5 | Holding Method | Porous Vacuum Chuck Table |
| 6 | Post-grinding TTV | 1.5μm |
| 7 | Wafer-to-Wafer Thickness Deviation after Grinding | ±3μm |
| 8 | Surface Roughness after Fine Grinding | Ra＜10 nm |
| 9 | Overall Dimension | 1430×3300×1900 mm |
| 10 | Machine Weight | 5000kg |
Main Frame
| No. | Item | Description |
| 1 | Frame | Lower frame: 50×100 square tube welded support (Standard) |
| Upper frame: 30×60 aluminum profile | ||
| 2 | Cover Plate | Cold rolled sheet with plastic spraying surface (Standard) |
| 3 | Structural Components | 45# steel with chrome plating, aluminum alloy with anodic oxidation |
| 4 | Power Supply | 3-phase 380 V, 50 Hz |
| 5 | Air Supply | ≥0.5 MPa, 400 L/min |
Product Details
Equipped with dual 9.5kW air-bearing spindles and 3 chuck tables for ultra-low vibration. It delivers post-grinding TTV ≤1.5μm, wafer-to-wafer thickness deviation ±3μm and surface roughness Ra＜10nm, greatly lowering chipping rate of SiC substrates.
It supports processing of SiC, LN, LT and sapphire substrates up to 8 inches, compatible with silicon wafers, ceramics and LED substrates. Custom grinding process recipes can be saved in the system.
The Z-axis features a minimum feed increment of 0.1μm for ultra-thin silicon wafer thinning. It maintains stable thickness control on hard brittle materials like SiC without deep subsurface damage.
Air-bearing spindles and grinding wheels are self-developed. Key parts adopt top brands including Tokyo Seimitsu, Mitsubishi, THK, SMC and Schneider. Standard spare parts are in stock for easy daily maintenance.
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