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HY-PS8180 Fully Automatic Semiconductor Molding System is designed for efficient encapsulation of ICs and power devices, ensuring stable quality and reliable protection.
Brand :
HYRNUSItem No. :
HY-PS8180Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaFully Automatic Semiconductor Molding System for IC Packaging
Product Introduction
HY-PS8180 Fully Automatic Semiconductor Molding System is designed to improve production output, yield, and process reliability for high-volume semiconductor packaging. Through automated operation and precise process control, it reduces manual intervention, minimizes production variability, and ensures consistent molding quality. The system also supports intelligent monitoring, production data recording, and process traceability, making quality management more efficient. With stable performance, easy maintenance, and lower operating costs, it is suitable for various package types, including SOT, SOP, TOLL, TO, QFN, DFN, and BGA.
Product Features
Application Fields
This fully automatic molding system is applicable for a wide range of semiconductor package types, including SOT, SOP, TOLL, TO, QFN, DFN, and BGA.
Applicable Industries
*Integrated circuit packaging and testing
*Discrete semiconductor devices
*Optoelectronic devices
Technical Parameter
| No | Parameter | Specification |
| 1. | Model | HY-PS8180 (180T) |
| 2. | Mold Quantity per Cycle | 2 leadframes per stroke per press |
| 3. | Number of Presses | 1 to 4 presses |
| 4. | Leadframe Size (L/F) | Width: 20–100mm / Length: 124–300mm / Thickness: 0.1–0.6mm |
| 5. | Resin Compound Size | Diameter: 11–20mm (±0.2mm) / L/D ratio: 1.2–1.7 (Max 35mm) |
| 6. | Clamping Force | 98–1764 kN (Max 180T) |
| 7. | Injection Pressure | 4.9–29.4 kN (Max 3T) |
| 8. | Cycle Time (Mechanical) | 28 sec (Min) |
| 9. | Machine Dimensions (4 Presses) | Width: 1833mm / Height: 2050mm / Length: 4663mm |
| 10. | Machine Weight (4 Presses) | 14500 kg |
| 11. | Power Supply | 3-phase 380VAC ±10% / Power: ≤51 KW (4 presses) |
| 12. | Compressed Air Supply | Pressure ≥0.5Mpa / Flow ≥350L/min / With air filter |
| 13. | Exhaust Requirement | ≥3000 L/min |
| 14. | Ambient Temperature | 0–40°C (non-freezing) |
| 15. | Ambient Humidity | ≤75% RH (non-condensing) |
| 16. | Auto Lubrication | Optional |
| 17. | Resin Weighing | Optional |
| 18. | Vacuum System | Optional |
Process
Product Details
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