Max 120T High Performance Fully Automatic Molding System for Semiconductor Package

HY-PS8120 Molding System is a fully automatic molding system designed for semiconductor packaging, supporting a wide range of package types including SOT, SOP, TOLL, TO, QFN, DFN, and BGA.

Brand :
HYRNUS
Item No. :
HY-PS8120
Order(MOQ) :
1 Set
Warranty :
One-Year Warranty and Lifetime Maintenance
Payment :
T/T
Lead Time :
7-35 Days
Product Origin :
China

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Max 120T High Performance Fully Automatic Molding System for Semiconductor Package

Product Introduction

HY-PS8120 Entire Line Press Molding Equipment delivers increased output and efficiency, significantly improved yield and reliability, strong process consistency that eliminates human variability, intelligent traceability, and cost-effective maintenance advantages. The system handles 2 leadframes per stroke per press and can be configured with 1 to 4 presses, accommodating leadframe sizes of 20–80mm in width, 124–270mm in length, and 0.1–0.6mm in thickness. It supports resin compound diameters of 11–20mm (±0.2mm) with an L/D ratio of 1.2–1.7 (max 35mm). The clamping force reaches up to 1176 kN (max 120T) with injection pressure of 4.9–29.4 kN (max 3T), and achieves a minimum mechanical cycle time of 28 seconds. With 4 presses, the system measures 3803mm in length, 1728mm in width, and 1920mm in height, weighing approximately 10,000 kg. It operates on 3-phase 380VAC ±10% with power consumption of ≤51 kW (4 presses), requiring compressed air of ≥0.5 MPa at ≥350 L/min with air filter, exhaust of ≥3000 L/min, and operates in ambient temperatures of 0–40°C with humidity ≤75% RH. Optional features include auto lubrication, resin weighing, and vacuum system.

Feature

Increased Output & Efficiency

Significantly Improved Yield & Reliability

Strong Process Consistency – Eliminates Human Variability

Intelligent & Traceable

Cost & Maintenance Advantage

Technical Specifications

Parameter	Specification
Model	HY-PS8120
Mold Quantity per Cycle	2 leadframes per stroke per press
Number of Presses	1 to 4 presses
Leadframe Size (L/F)	Width: 20–80mm / Length: 124–270mm / Thickness: 0.1–0.6mm
Resin Compound Size	Diameter: 11–20mm (±0.2mm) / L/D ratio: 1.2–1.7 (Max 35mm)
Clamping Force	98–1176 kN (Max 120T)
Injection Pressure	4.9–29.4 kN (Max 3T)
Cycle Time (Mechanical)	28 sec (Min)
Machine Dimensions (4 Presses)	Width: 1728mm / Height: 1920mm / Length: 3803mm
Machine Weight (4 Presses)	10,000 kg
Power Supply	3-phase 380VAC ±10% / Power: ≤51 KW (4 presses)
Compressed Air Supply	Pressure ≥0.5Mpa / Flow ≥350L/min / With air filter
Exhaust Requirement	≥3000 L/min
Ambient Temperature	0–40°C (non-freezing)
Ambient Humidity	≤75% RH (non-condensing)
Auto Lubrication	Optional
Resin Weighing	Optional
Vacuum System	Optional