HY-DS30K is an high-speed integrated dicing saw developed for post-mold singulation of semiconductor molded substrates. It supports an integrated processing flow including substrate cutting, cleaning, vision inspection, sorting and tray binning, which greatly improves the production efficiency of standard semiconductor backend packaging processes.
Brand :
HYRNUSItem No. :
HY-DS30KOrder(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
Chinaleave a message
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