What Are You Looking For?
HY-TF100 is designed for post-mold semiconductor IC lead trimming, pin forming and singulation. Compatible with mainstream miniature packages including SOT, SOD, TSOT and PDFN, it delivers a punching speed of 120–200 SPM. Featuring servo feeding and dual non-stop spring clamps, this equipment significantly boosts throughput of semiconductor packaging lines. It is equipped with complete safety protection as standard, while optional CCD visual inspection and MES networking are available to support smart factory digital management.
Brand :
HYRNUSItem No. :
HY-TF100Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaSemiconductor Lead Frame Trimming Forming and Singulation Machine | High-Speed Punch System
Product Introduction
HY-TF100 Semiconductor Lead Frame Trimming, Forming and Singulation Machine is key backend packaging equipment. After chip molding, lead frames undergo trimming, forming and singulation to remove ribs, shape pins and separate single ICs.
This machine features full servo-driven construction for stable high-speed punching with zero dimensional deviation. Dual independent spring clamps enable offline material swapping to cut downtime and boost production efficiency. Equipped with light curtains, door sensors and emergency stop buttons for full operator safety, it supports optional CCD visual inspection and MES networking for smart factory monitoring. It fits packaging lines for small discrete devices and miniature power ICs.
Product Application
Suitable for packaging production lines of small discrete devices and miniature power ICs with SOT, SOD, TSOT and PDFN packages.
Product Features
1. Integrated Process: One-stop solution for post-mold lead trimming, pin forming and IC singulation
2. High Productivity: Dual spring clamps enable non-stop material swapping to cut downtime and raise overall throughput
3. Precise & Stable Output: Full servo motor + reducer drive ensures punching with zero dimensional deviation
4. Easy Operation: PLC + touchscreen human-machine interface for simple operation
5. Comprehensive Safety Protection: Multi-layer safety components fully protect operators during operation
6. Intelligent Upgrade Options: Optional CCD visual defect inspection and MES networking for smart factory data monitoring
Technical Specifications
| Item | Details |
| Punching System | High-speed punching system |
| Application | Trimming, forming and singulation of lead frames after chip plastic encapsulation |
| Compatible Packages | SOT, SOD, TSOT, PDFN |
| Punching Speed (SPM) | 120–200 strokes per minute |
| Control System | PLC (Mitsubishi / Yonghong) + Touch Screen + Operation Buttons |
| Power System | Servo motor + Reducer |
| Feeding Mechanism | Servo roller feeding |
| Loading Mechanism | Dual independent spring clamps for non-stop cyclic loading |
| Unloading Mechanism | Tube collection into material boxes |
| Safety Design | Light curtains, door open sensors and emergency stop buttons for full protection |
| Optional Accessory 1 | CCD visual inspection device |
| Optional Accessory 2 | MES networking function |
Product Details
HY-TF200L adopts dual lower flywheel stamping system for semiconductor post-molding lead frame trimming, forming & singulation, compatible with SOT, TO, SOP and DIP packages. It runs 80–120 strokes per minute with PLC control and full safety interlocks, supporting optional CCD visual inspection and MES system networking. Comes with full series precision mold spare parts, it meets mass IC packaging production requirements.
HY-TF200U is specially designed for post-molding lead trimming, forming and separation of semiconductor packaging components. Compatible with SOT, TO, SOP, DIP, IPM, photovoltaic modules & optocouplers. Equipped with full servo drive system, dual magazine non-stop feeding, safety light curtain protection, optional CCD visual inspection and MES networking function, punching speed up to 30–60 SPM, stable high-efficiency mass production solution for IC packaging industry.
HY-TFS210 Lead Cutting Machine is an automatic trim and form system specifically designed for SMA, SMB, and SMC package products. It features a simple structure with stable and reliable performance, a small footprint, fast and stable operation, low noise, and easy operation and maintenance, significantly reducing labor intensity.
HY-TF110 Semiconductor Post Mold Equipment is an automatic trim and form system specifically designed for SOT23-3L-20R package products.Achieving a remarkable 580K UPH with a punching stroke rate of 130 strokes per minute，maximizes throughput while maintaining tool life of 1.5 million strokes.
HY-TF221 IC Trim and Form Machine is an automatic trim and form system specifically designed for TO220 package products.it an efficient and cost-effective Trim and Form Machine for modern semiconductor packaging lines seeking higher throughput, superior product quality, and lower operating costs.
HY-TF210 Trim Roll Former is an automatic trim and form system specifically designed for TO252-6R package products. It delivers a throughput of ≥70k per hour with a punching stroke rate of 50–60 strokes per minute, and features MTBA of ≥40 minutes, MTBF of ≥120 hours, MTTA of ≤5 minutes, and downtime rate of ≤3%.
HY-DS30K is an high-speed integrated dicing saw developed for post-mold singulation of semiconductor molded substrates. It supports an integrated processing flow including substrate cutting, cleaning, vision inspection, sorting and tray binning, which greatly improves the production efficiency of standard semiconductor backend packaging processes.
leave a message
Scan To Wechat :
Scan To WhatsApp :
