ultrasonic wire bonding

The HY-WB400/HY-WB400P Wire Bonding Machine is a tilting and rotatable workholder wire bonding system designed for multi-planar interconnection in optical communication device packaging. It features automatic material handling, customizable fixtures, programmable optical path, and a high-precision XYZR direct drive system. With fast changeover and PR Look Ahead, it delivers high UPH and efficient production performance.

HY-WB350PM / HY-WB350M Gold Wire Wedge Bonding Machine is designed for internal chip-to-pin interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, microwave, optoelectronic and automotive electronic devices. It supports products under 200 mm and provides stable ultrasonic output for reliable bonding performance.

HY-BW830 Wire Bonder is an aluminum wire bonding system designed for power module assembly, primarily used for lead connection between batteries and bus bars, supporting aluminum wire diameters of 125–500 μm.

HY-HW3741A Automatic Ultrasonic Heavy Aluminum Wire Wedge Bonder features a rotary bonding head, automatic digital frequency tracking, precise pressure control, advanced image recognition, and closed-loop motion control. 

HY-HW3850 Automatic Ultrasonic Heavy Aluminum Wire Wedge Bonder is designed for high-efficiency wire bonding of power semiconductor packages such as TO-220, TO-247, TO-252, TO-251 and TO-263. Featuring dual bonding heads, PR visual positioning and automatic loading and unloading, it supports aluminum wire diameters from 125 to 500 μm, delivering accurate, stable and consistent bonding for mass production.

HY-HW3200 Ultrasonic Heavy Aluminum Wire Wedge Bonder is designed for internal wire bonding of power semiconductor devices such as MOSFETs, high-power transistors, diodes, thyristors and power modules. It features precise motion control, adjustable bonding parameters, stable ultrasonic output and support for 1–6 bonding points, ensuring reliable bonding quality and efficient operation.

HY-WB2000 ultrasonic wire bonder uses fine aluminum wire, pressure, and ultrasonic energy to create reliable electrical connections between chips and substrates. It is suitable for microwave devices, RF modules, hybrid circuits, MEMS, optoelectronic devices, sensors, semiconductor devices, radar devices, COB/SOB packaging, and other microelectronic applications.