What Are You Looking For?
HY-DC1000 is equipped with a wide coverage rotary gun and interchangeable nozzles ranging from 20 to 80mm, customized for large flat workpieces including full-size PCBs, new energy battery electrodes, automotive plastic components and display glass panels. It supports 0–1000W wide-range adjustable power to form uniform plasma coverage over large surfaces, efficiently stripping organic contaminants and eliminating printing voids & coating delamination issues for mass-production inline assembly lines.
Brand :
HYRNUSItem No. :
HY-DC1000Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
China1000W Adjustable Digital Rotary Circular Plasma Cleaning Machine for PCB Mass Line
Product Introduction
HY-DC1000 Digital Rotary Circular Plasma Cleaning Machine adopts AC220V power supply with adjustable 0–1000W output. Built with military-grade hardware that stably operates at -25℃~50℃ and delivers an MTBF of over 190,000 hours, it is equipped with ST ARM digital monitoring system and TI soft-switch circuit with response time less than 0.1s. This machine supports RS485, I/O and manual control modes, with six real-time detection modules and complete safety alarm protection; its plasma gun matches interchangeable 20–80mm nozzles to offer 20–80mm effective treatment width under 5–20mm adjustable working height, specially designed for mass processing of large flat workpieces.
It adopts zero-potential low-temperature treatment to prevent damage to PCBs and semiconductor parts. Fully compatible with automated production lines, it realizes surface cleaning and activation merely with dry compressed air, greatly enhancing bonding strength for bonding, printing and coating procedures in 3C electronics, semiconductor, automotive and new energy industries.
Product Application
This equipment is mainly designed for the semiconductor industry. It provides cleaning and activation before die bonding, wire bonding, molding and dispensing, cleans wafers, lead frames and BGA substrates to remove oily dirt and organic particles, and improves packaging adhesion and production yield.
It is also widely applied in 3C display, camera module, PCB/FPC, LED, automotive, new energy and other fields. For plastic, glass, ceramic, metal, PI, ITO and special materials, it realizes surface cleaning and activation before bonding, printing, coating and welding to eliminate poor adhesion, packaging voids and printing defects.
Product Features
1. Military-grade hardware design, operating ambient temperature ranges from -25°C to 50°C to adapt to various harsh working conditions. Its MTBF (Mean Time Between Failures) reaches ≥190,000 hours under MIL-HDBK-217F standard at 25°C.
2. Full digital control, digital display and real-time monitoring with strong anti-interference performance.
3. Adopts TI phase-shift full-bridge soft-switching circuit and PFC power factor correction. Compared with analog hard-switching circuits, its efficiency is improved by over 10% with a response time less than 0.1s and outstanding anti-interference capability.
4. Equipped with ST brand ARM chip for intuitive human-machine interaction. It supports powerful remote debugging communication and seamless integration with diverse application scenarios. The self-developed software intelligently analyzes real-time collected data for coordinated operation and automatic power matching to maintain stable output.
5. Supports RS-485 communication and I/O control interfaces with multi-data remote monitoring function.
6. Six real-time detection functions: air pressure, mainboard temperature, transformer arc voltage, transformer primary peak current, grid current and spray gun rotation speed monitoring.
7. Over ten types of fault alarms, cutting fault troubleshooting time by more than 80%. It supports jet spray guns, rotary spray guns and linear wide-width guns with one-click switching.
8. Comprehensive protection mechanisms including over-temperature, overload, short-circuit, open-circuit, electric leakage and misoperation protection.
Equipment Structure
The atmospheric direct-spray plasma surface treatment system mainly consists of a power generator, plasma generating spray gun and control system.
1. Power Generator
It supports automatic power matching to deliver stable, high-precision power output. The output power remains unaffected by air pressure fluctuations. Parameters can be adjusted according to actual workpiece conditions to achieve optimal treatment results.
2. Rotary Plasma Gun
It is mainly used for processing large-area and complex-shaped workpieces with an effective treatment width ranging from 20mm to 80mm. Compatible with existing production assembly lines, it enables fully automatic inline manufacturing and reduces labor costs effectively.
3. Control System
The control system is integrated inside the main unit of the power generator. It governs the operation of the atmospheric plasma cleaner and provides overall system protection.
Plasma Generator DimensionsMain Unit Outline Dimension Drawing
Plasma Gun Dimensions
Outline Drawing of Plasma Gun
Technical Specifications: Atmospheric Plasma Generator Main Unit
1. Atmospheric Plasma Generator
(1) Main Unit Parameters
| Item | Parameter |
| Model | HY-DC1000 |
| Overall Dimension | 491*200*332mm (LWH) |
| Weight | 10KG |
| Input Power Supply | AC220V |
| Power Frequency | 25KHZ |
| Plasma Output Power | 0–1000W, adjustable and displayable |
| Control Mode | RS485 / I/O control / Manual |
| Protection & Alarm Functions | Rotation speed, temperature, voltage, air pressure, overload, electric leakage, power mismatch, short circuit, open circuit, overcurrent protection, etc. |
| Detection Functions | Air pressure detection, power detection, rotation detection, output power detection, mainboard temperature detection, transformer primary peak current detection |
(2) Atmospheric Direct-Spray Plasma Gun Specifications
| Item | Parameter |
| Gun Dimension | 314.5mm*95mm |
| Standard Nozzle Sizes | 20mm, 40mm, 60mm, 80mm |
| Plasma Working Height | 5–20mm |
| Effective Plasma Treatment Width | 20–80mm |
| Air Pressure Range | Standard 0.2MPa, adjustable from 0.08–0.25MPa |
2. Factory Installation Requirements
| Item | Requirements |
| Power Supply Required | Single-phase AC220V, 10A; grounding resistance less than 4Ω |
| Exhaust System | Flow rate: 5m³/min; Corrosion-resistant material |
| Compressed Air Requirements | Pipe diameter: 8mm |
| Pipe material: PU tube | |
| Air pressure: 0.4–0.6MPa | |
| Air quality standard: | |
| Solid particle size ≤0.1μm, oil content ≤0.01mg/m³, pressure dew point ≤ -40℃ |
| Item | Details |
| Hazard Label | High-voltage hazard warning label |
| Operating Environment | Temperature: 15~35℃ |
| Humidity: 30~80% | |
| Other Precautions | Keep away from flammable gas, corrosive gas, explosive and reactive dust |
Product Details
The equipment is equipped with 6 independent real-time detection sensors to monitor compressed air pressure, mainboard temperature, transformer arc voltage, transformer primary peak current, grid current and rotary gun speed. All operating data is displayed digitally, with a full set of safety interlock alarms to monitor the whole machine around the clock.
Adopting military-grade hardware complying with MIL-HDBK-217F standard, it reaches an MTBF of ≥190,000 hours at 25°C. It can run continuously stably from -25°C to 50°C with strong anti-electromagnetic interference performance, suitable for high/low-temperature complex production workshops of electronics, automotive and new energy industries.
It adopts multi-layer comprehensive protection, including over-temperature, overload, short circuit, open circuit, electric leakage, misoperation, abnormal air pressure and power mismatch protection. Digital sound-light alarms will be triggered once any abnormality occurs, effectively reducing unexpected downtime of automatic production lines.
It delivers three core dry treatment functions:
1. Precision cleaning to remove oil stains, organic particles and static electricity;
2. Surface activation to raise material surface tension and greatly improve adhesion for bonding, printing and coating;
3. Micro-etching modification to fundamentally eliminate defects such as glue peeling, printing flaking and packaging delamination, with zero chemical solvent pollution.
HY-AD03 is an atmospheric direct plasma cleaning device designed for surface cleaning, activation and modification under ambient air conditions. It features concentrated energy with a small treatment footprint, which effectively improves product adhesion, hydrophilicity and printability. It can also remove contaminants such as organic residues, oil stains and oxide layers from material surfaces.
HY-TM500 works under atmospheric pressure without vacuum chambers. Custom 3-axis rails deliver full-coverage precise treatment. Built with military-grade hardware and digital control, it supports 0–800W adjustable power. Zero-potential low-temperature plasma protects PCB, FPC and semiconductor components, completing surface cleaning, activation and modification to boost adhesion for bonding, printing and coating. It is ready for inline automation in 3C, display, semiconductor, automotive and new energy industries.
HY-DD600 adopts narrow small nozzle design (2–6mm effective width), dedicated for tiny precision sensitive parts including chips, FPC flexible circuits, miniature BGA substrates. Zero-potential low-temperature plasma jet eliminates thermal burn risk for ultra-thin PI/ITO materials. Its compact gun fits narrow gaps and complex micro-structures, perfectly matching small automatic bonding & dispensing lines for semiconductor packaging and camera module pretreatment.
HY-AC500 adopts rotary plasma spray gun and dual manual & I/O control modes, realizing uniform cleaning, activation and micro-etching for PCB, FPC, BGA and semiconductor chips. It features military-grade hardware, digital real-time monitoring and multi-layer safety protection. This desktop 1000W analog plasma machine is widely used for pre-treatment in semiconductor packaging, 3C electronics, display, automotive electronics and new energy industries.
HY-AC1000H uses vacuum-free low-temperature neutral plasma, fitted with customizable rails and dual rotary guns. With 0–1000W adjustable power and 20–80mm treatment width, it safely cleans chips without thermal damage. Combined physical & chemical dry cleaning enhances bonding for die attach, wire bonding and molding to reduce delamination and voids. Supporting manual & IO control with full safety monitoring, it connects to auto lines for continuous processing of substrates, lead frames and large FPC panels, delivering stable long-hour full-load production with response time below 0.1s.
HY-AS1200 is fitted with a motor-driven rotating nozzle to create an even plasma surface. With a treatment width of 20–80 mm and adjustable power ranging from 0 to 1200 W, it perfectly matches batch pre-treatment of large-area lead frames and substrates. The room-temperature neutral plasma will not damage chips, dry removing organic residues and surface oxides under atmospheric pressure to strengthen adhesion for die attach, wire bonding and molding while cutting delamination and void defects. Equipped with multi-layer safety protection and fully compatible with automated production lines, this equipment is widely used in packaging and testing procedures for ICs, FPCs and automotive chips.
HY-AD800 safely processes delicate chips, PCBs and plastic components without thermal deformation. Equipped with 0–800W adjustable power, IO/manual dual operation and complete safety protection, it can be easily integrated into automated production lines for surface cleaning, activation and improved bonding, making it ideal for semiconductor packaging, 3C electronics, automotive, new energy and LED manufacturing.
leave a message
Scan To Wechat :
Scan To WhatsApp :
