What Are You Looking For?
HY-DD600 adopts narrow small nozzle design (2–6mm effective width), dedicated for tiny precision sensitive parts including chips, FPC flexible circuits, miniature BGA substrates. Zero-potential low-temperature plasma jet eliminates thermal burn risk for ultra-thin PI/ITO materials. Its compact gun fits narrow gaps and complex micro-structures, perfectly matching small automatic bonding & dispensing lines for semiconductor packaging and camera module pretreatment.
Brand :
HYRNUSItem No. :
HY-DD600Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
China600W Adjustable Digital Low-Temperature Direct Spray Plasma Cleaning Machine for Semiconductor Chips
Product Introduction
HY-DD600 Digital Low-Temperature Direct-Spray Plasma Cleaning Machine adopts full digital intelligent control and a narrow nozzle with a 2–6mm effective treatment width, designed for miniature precision parts including chips, FPCs and micro BGA substrates. Its neutral zero-potential low-temperature plasma jet releases mild heat to avoid thermal damage on ultra-thin PI & ITO thin films, and the compact gun can reach tiny gaps and intricate micro-structures.
Working under atmospheric pressure, it delivers precise cleaning, surface activation and micro-etching without harming workpieces. Equipped with full digital power adjustment, it perfectly matches small bonding and dispensing lines for semiconductor packaging and camera module pretreatment, solving adhesion failure, delamination and peeling problems in bonding, printing and dispensing processes.
Product Features
1. Military-standard hardware supports stable operation at -25°C~50°C; MTBF ≥190,000hrs per MIL-HDBK-217F (25°C).
2. Full digital control & display for real-time monitoring and strong noise immunity.
3. TI soft-switch circuit + PFC correction boosts efficiency by 10%+, response under 0.1s with great anti-interference ability.
4. ST ARM chip delivers simple HMI and remote debugging. Self-developed program achieves auto power matching for steady output.
5. RS-485 & I/O ports support multi-data remote monitoring.
6. Six real-time monitoring items: air pressure, motherboard temp, transformer arc voltage, primary peak current, mains current, gun rotating speed.
7. 10+ fault alerts cut diagnosis time by over 80%; one-click switch for jet, rotary and linear spray heads.
8. Complete safety protection: overheat, overload, short/open circuit, leakage and wrong operation protection.
Product Application
This equipment processes precision curved and irregular workpieces to conduct surface cleaning, molecular activation and micro-etching. It thoroughly resolves common production issues including poor adhesion, glue delamination and ink peeling.
It serves as essential pre-treatment equipment for various sectors: semiconductor packaging, 3C electronics, touch panels, LED encapsulation, automotive parts, new energy lithium batteries, plastic, metal and glass materials.
Equipment Structure
The open-air direct jet plasma surface treatment system consists of three core parts: power supply unit, direct jet plasma spray gun and control module.
1. Power Generator
It supports automatic power matching to deliver stable, high-precision output without being disturbed by air pressure fluctuations. Operators can adjust all operating parameters according to the actual working state of samples for ideal processing performance.
2. Direct-Spray Plasma Gun
Designed for tiny, intricately shaped workpieces, this gun delivers a treatment width ranging from 2mm to 6mm. It can be integrated with existing production lines to enable fully automatic inline processing and cut labor expenses.
3. Control System
Housed inside the power supply main unit, this module governs the whole operation of the atmospheric plasma cleaner and provides full-system safety protection.
Plasma Generator DimensionsMain Unit Outline Dimension Drawing
Plasma Gun Dimensions
Outline Drawing of Plasma Gun
Technical Specifications: Atmospheric Plasma Generator Main Unit
1. Atmospheric Plasma Generator
(1) Main Unit Parameters
| Item | Parameter |
| Model | HY-DD600 |
| Overall Dimension | 491*200*332 mm (Length * Width * Height) |
| Weight | 10 KG |
| Input Power Supply | AC 220V |
| Power Frequency | 25 KHz |
| Plasma Output Power | 0–600 W, adjustable & displayable |
| Control Mode | RS485 / I/O Control / Manual |
| Protection & Alarm Functions | Rotation speed, temperature, voltage, air pressure, overload, electric leakage, power mismatch, short-circuit, open-circuit, overcurrent protection |
| Detection Functions | Air pressure detection, power detection, rotation detection, output power detection, mainboard temperature detection, transformer primary peak current detection |
(2) Atmospheric Direct-Spray Plasma Gun Specifications
| Item | Parameter |
| Gun Dimension | 255.5 mm * 50 mm |
| Nozzle Sizes | Standard 2 mm, 4 mm, 6 mm |
| Plasma Treatment Height | 3–20 mm |
| Effective Plasma Treatment Width | 1–8 mm |
| Air Pressure Range | Standard 0.2 MPa, adjustable from 0.08–0.25 MPa |
2. Factory Installation Requirements
| Item | Specifications |
| Power Supply Requirement | Single-phase AC220V, 10A; grounding resistance less than 4Ω |
| Factory Exhaust System | Flow rate: 5m³/min; Material: corrosion-resistant material |
| Factory Compressed Air Requirements | Pipe diameter: 8mm |
| Pipe material: PU tube | |
| Pressure: 0.4–0.6MPa | |
| Air quality standard: | |
| Solid particle diameter ≤0.1μm, | |
| Oil content ≤0.01mg/m³, | |
| Dew point ≤ -40°C |
| Item | Details |
| Hazard Marking | High Voltage Warning Label |
| Operating Environment | Temperature: 15~35°C |
| Humidity: 30~80% | |
| Other Precautions | The working area must be free of flammable gas, corrosive gas, explosive or reactive dust |
Product Details
Yes. It supports RS485 and I/O control with 0–600W adjustable digital power. The compact direct-spray gun can be seamlessly integrated into dispensing, packaging and coating automatic assembly lines.
No. Equipped with zero-potential design, this plasma cleaner generates low heat without thermal burns, perfectly suitable for precision semiconductor and FPC substrate pretreatment.
HY-AD03 is an atmospheric direct plasma cleaning device designed for surface cleaning, activation and modification under ambient air conditions. It features concentrated energy with a small treatment footprint, which effectively improves product adhesion, hydrophilicity and printability. It can also remove contaminants such as organic residues, oil stains and oxide layers from material surfaces.
HY-TM500 works under atmospheric pressure without vacuum chambers. Custom 3-axis rails deliver full-coverage precise treatment. Built with military-grade hardware and digital control, it supports 0–800W adjustable power. Zero-potential low-temperature plasma protects PCB, FPC and semiconductor components, completing surface cleaning, activation and modification to boost adhesion for bonding, printing and coating. It is ready for inline automation in 3C, display, semiconductor, automotive and new energy industries.
HY-DC1000 is equipped with a wide coverage rotary gun and interchangeable nozzles ranging from 20 to 80mm, customized for large flat workpieces including full-size PCBs, new energy battery electrodes, automotive plastic components and display glass panels. It supports 0–1000W wide-range adjustable power to form uniform plasma coverage over large surfaces, efficiently stripping organic contaminants and eliminating printing voids & coating delamination issues for mass-production inline assembly lines.
HY-AC500 adopts rotary plasma spray gun and dual manual & I/O control modes, realizing uniform cleaning, activation and micro-etching for PCB, FPC, BGA and semiconductor chips. It features military-grade hardware, digital real-time monitoring and multi-layer safety protection. This desktop 1000W analog plasma machine is widely used for pre-treatment in semiconductor packaging, 3C electronics, display, automotive electronics and new energy industries.
HY-AC1000H uses vacuum-free low-temperature neutral plasma, fitted with customizable rails and dual rotary guns. With 0–1000W adjustable power and 20–80mm treatment width, it safely cleans chips without thermal damage. Combined physical & chemical dry cleaning enhances bonding for die attach, wire bonding and molding to reduce delamination and voids. Supporting manual & IO control with full safety monitoring, it connects to auto lines for continuous processing of substrates, lead frames and large FPC panels, delivering stable long-hour full-load production with response time below 0.1s.
HY-AS1200 is fitted with a motor-driven rotating nozzle to create an even plasma surface. With a treatment width of 20–80 mm and adjustable power ranging from 0 to 1200 W, it perfectly matches batch pre-treatment of large-area lead frames and substrates. The room-temperature neutral plasma will not damage chips, dry removing organic residues and surface oxides under atmospheric pressure to strengthen adhesion for die attach, wire bonding and molding while cutting delamination and void defects. Equipped with multi-layer safety protection and fully compatible with automated production lines, this equipment is widely used in packaging and testing procedures for ICs, FPCs and automotive chips.
HY-AD800 safely processes delicate chips, PCBs and plastic components without thermal deformation. Equipped with 0–800W adjustable power, IO/manual dual operation and complete safety protection, it can be easily integrated into automated production lines for surface cleaning, activation and improved bonding, making it ideal for semiconductor packaging, 3C electronics, automotive, new energy and LED manufacturing.
leave a message
Scan To Wechat :
Scan To WhatsApp :
