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HY-AC500 adopts rotary plasma spray gun and dual manual & I/O control modes, realizing uniform cleaning, activation and micro-etching for PCB, FPC, BGA and semiconductor chips. It features military-grade hardware, digital real-time monitoring and multi-layer safety protection. This desktop 1000W analog plasma machine is widely used for pre-treatment in semiconductor packaging, 3C electronics, display, automotive electronics and new energy industries.
Brand :
HYRNUSItem No. :
HY-AC500Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaAnalog Circular Rotary Platform Atmospheric Plasma Cleaner for Electronic Components
Product Introduction
HY-AC500 Analog Rotary Work Platform Atmospheric Plasma Cleaner is a military-grade atmospheric plasma surface treatment system built for desktop small-batch industrial production. Outfitted with an analog rotary work platform and direct jet rotary plasma gun, the machine provides consistent plasma coverage across a 20–80mm effective treatment width. It eliminates typical manufacturing issues such as poor adhesion, peeled printing ink and detached glue, making it a vital pre-treatment equipment for semiconductor packaging, electronic assembly, plastic, metal and glass.
It adopts military-grade intelligent control design with high power factor and full safety protection, featuring ultra-fast system response, supporting wide-temperature stable operation and long-term reliable mass production with strong anti-interference ability. Real-time data monitoring functions are equipped to facilitate daily production management.
Product Application
1. Semiconductor IC Packaging: HY-AC500 atmospheric rotary plasma cleaner pre-cleans wafers, BGA, lead frames and chips before die attach, wire bonding and molding. Zero-potential design protects IC chips and removes contaminants to boost packaging yield.
2. Advanced Packaging: Plasma activation for flip chip, underfill and encapsulation, lowering voids and package delamination.
3. 3C & Display: Processes LCD, FPC, PCB and camera modules to improve bonding and printing adhesion.
4. Automotive & New Energy: Plasma treatment for auto electronics and lithium battery shells to solve poor adhesion and ink peeling.
5. Plastic, Metal, Glass & LED: Plasma modification for LED packaging, Teflon activation, metal plating and glass pre-coating.
6. In-line Integration: 20–80mm wide rotary plasma gun, easily fitted to automated packaging and coating production lines.
Product Features
1. Built on military-standard hardware architecture, the unit runs reliably from -25°C to 50°C to adapt to severe working conditions. Per MIL-HDBK-217F standard at 25°C, its MTBF exceeds 190,000 hours.
2. Full digital control & display enables constant real-time tracking with strong anti-interference performance.
3. It integrates air pressure check, motherboard temperature monitoring and power regulation functions.
4. The proprietary intelligent chip control system delivers real-time monitoring under 0.1s response latency and robust anti-disturbance ability.
5. With plasma power factor over 79%, it maintains stable dynamic balance and sufficient electrode discharge saturation.
6. Comprehensive safety safeguards are provided against overheat, overload, short circuit, open circuit, electric leakage and wrong operations.
Equipment Structure
The atmospheric rotary plasma surface treatment machine consists of three key assemblies: power generator, rotary plasma spray gun and control system.
1. Power Generator
It supports automatic power matching technology to output steady and high-accuracy power, which stays unaffected by gas pressure fluctuations. Users can adjust relevant parameters based on actual sample features to achieve optimal surface processing outcomes.
2. Direct Plasma Spray Gun
This rotary spray gun is designed for large-area and complex-shaped workpieces, with its effective processing width ranging from 20mm to 80mm. It can coordinate with existing production lines to carry out full-automatic inline processing and cut manual labor costs.
3. Control System
The control system is housed inside the main cabinet of the power generator. It governs the whole running status of the atmospheric plasma cleaner and delivers all-round safety protection for the complete equipment system.
Plasma Generator DimensionsMain Unit Outline Dimension Drawing
Plasma Gun Dimensions
Outline Drawing of Plasma Gun
Technical Specifications: Atmospheric Plasma Generator Main Unit
1. Atmospheric Plasma Generator
(1) Main Unit Parameters
| Item | Specification |
| Model | HY-AC500 |
| Overall Dimension | 479*200*325mm (LWH) |
| Weight | 10KG |
| Input Power Supply | AC220V |
| Power Frequency | 25KHz |
| Plasma Output Power | 0–1000W, adjustable with digital display |
| Control Mode | I/O control / Manual operation |
| Protection & Alarm | Temperature, air pressure, overload, electric leakage, short circuit and open circuit protection functions |
| Detection Functions | Air pressure detection, power detection, mainboard temperature detection |
(2) Direct Injection Plasma Spray Gun Specifications
| Item | Specification |
| Spray Gun Dimension | 314.5mm*95mm |
| Standard Nozzle Sizes | 20mm, 40mm, 60mm, 80mm |
| Plasma Working Height | 5–20mm |
| Effective Plasma Treatment Width | 20–80mm |
| Air Pressure Range | Standard 0.2MPa, adjustable from 0.08–0.25MPa |
2. Factory Installation Requirements
| Item | Requirements |
| Power Supply Required | Single-phase AC220V, 10A; Ground resistance less than 4Ω |
| Factory Exhaust | Flow rate: 5m³/min; Pipe material: corrosion-resistant material |
| Factory Compressed Air Requirements | Pipe diameter: 8mm |
| Pipe material: PU tube | |
| Pressure: 0.4–0.6MPa | |
| Air source quality standard: | |
| Solid particle size ≤0.1μm, | |
| Oil content ≤0.01mg/m³, | |
|
Pressure dew point below -40℃ |
| Item | Content |
| Hazard Marking | High voltage hazard label |
| Operating Environment | Temperature: 15~35°C |
| Humidity: 30~80% | |
| Other Notes | Combustible gas, corrosive gas, explosive or reactive dust are prohibited in the working area |
Product Details
Absolutely not. It adopts zero-potential plasma technology, only modifying the nano-scale surface layer without thermal or mechanical damage. It is safe for ultra-thin FPC, semiconductor wafers, PI film and other delicate electronic components used in packaging processes.
Output power 0–1000W adjustable; interchangeable nozzles: 20/40/60/80mm, effective treatment width 20–80mm, working height adjustable from 5mm to 20mm.
Yes. It supports both manual operation and IO signal control. The patented control chip responds within 0.1s, with real-time monitoring of air pressure, power and mainboard temperature for stable inline mass production.
No vacuum chamber needed. It works under normal atmospheric pressure, saving vacuum equipment costs and simplifying integration with assembly, coating and packaging lines.
HY-AD03 is an atmospheric direct plasma cleaning device designed for surface cleaning, activation and modification under ambient air conditions. It features concentrated energy with a small treatment footprint, which effectively improves product adhesion, hydrophilicity and printability. It can also remove contaminants such as organic residues, oil stains and oxide layers from material surfaces.
HY-TM500 works under atmospheric pressure without vacuum chambers. Custom 3-axis rails deliver full-coverage precise treatment. Built with military-grade hardware and digital control, it supports 0–800W adjustable power. Zero-potential low-temperature plasma protects PCB, FPC and semiconductor components, completing surface cleaning, activation and modification to boost adhesion for bonding, printing and coating. It is ready for inline automation in 3C, display, semiconductor, automotive and new energy industries.
HY-DC1000 is equipped with a wide coverage rotary gun and interchangeable nozzles ranging from 20 to 80mm, customized for large flat workpieces including full-size PCBs, new energy battery electrodes, automotive plastic components and display glass panels. It supports 0–1000W wide-range adjustable power to form uniform plasma coverage over large surfaces, efficiently stripping organic contaminants and eliminating printing voids & coating delamination issues for mass-production inline assembly lines.
HY-DD600 adopts narrow small nozzle design (2–6mm effective width), dedicated for tiny precision sensitive parts including chips, FPC flexible circuits, miniature BGA substrates. Zero-potential low-temperature plasma jet eliminates thermal burn risk for ultra-thin PI/ITO materials. Its compact gun fits narrow gaps and complex micro-structures, perfectly matching small automatic bonding & dispensing lines for semiconductor packaging and camera module pretreatment.
HY-AC1000H uses vacuum-free low-temperature neutral plasma, fitted with customizable rails and dual rotary guns. With 0–1000W adjustable power and 20–80mm treatment width, it safely cleans chips without thermal damage. Combined physical & chemical dry cleaning enhances bonding for die attach, wire bonding and molding to reduce delamination and voids. Supporting manual & IO control with full safety monitoring, it connects to auto lines for continuous processing of substrates, lead frames and large FPC panels, delivering stable long-hour full-load production with response time below 0.1s.
HY-AS1200 is fitted with a motor-driven rotating nozzle to create an even plasma surface. With a treatment width of 20–80 mm and adjustable power ranging from 0 to 1200 W, it perfectly matches batch pre-treatment of large-area lead frames and substrates. The room-temperature neutral plasma will not damage chips, dry removing organic residues and surface oxides under atmospheric pressure to strengthen adhesion for die attach, wire bonding and molding while cutting delamination and void defects. Equipped with multi-layer safety protection and fully compatible with automated production lines, this equipment is widely used in packaging and testing procedures for ICs, FPCs and automotive chips.
HY-AD800 safely processes delicate chips, PCBs and plastic components without thermal deformation. Equipped with 0–800W adjustable power, IO/manual dual operation and complete safety protection, it can be easily integrated into automated production lines for surface cleaning, activation and improved bonding, making it ideal for semiconductor packaging, 3C electronics, automotive, new energy and LED manufacturing.
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