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HY-TM500 works under atmospheric pressure without vacuum chambers. Custom 3-axis rails deliver full-coverage precise treatment. Built with military-grade hardware and digital control, it supports 0–800W adjustable power. Zero-potential low-temperature plasma protects PCB, FPC and semiconductor components, completing surface cleaning, activation and modification to boost adhesion for bonding, printing and coating. It is ready for inline automation in 3C, display, semiconductor, automotive and new energy industries.
Brand :
HYRNUSItem No. :
HY-TM500Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaAutomatic 3-Axis Motion Platform Analog Low-Temperature Direct Injection Plasma Cleaner
Product Introduction
HY-TM500 Automatic 3-Axis Platform Plasma Cleaner is an atmospheric low-temperature direct-injection surface treatment machine. Fitted with customized 3-axis moving rails compatible with diverse production workflows, it can be directly integrated into automated production lines for fully automatic inline workpiece pre-treatment.
Its low-temperature electrically neutral plasma generates no harsh thermal shock and will not damage heat-sensitive precision parts such as FPC, PCB and semiconductors. The dry eco-friendly process eliminates chemical solvents and waste liquid, drastically fixing common defects including ink peeling, adhesive delamination and coating separation. It supports dual operation modes (manual & IO-linked auto control) with stepless adjustable power from 0 to 800W, ideal for both lab sampling and mass manufacturing.
Product Application
This automatic 3-Axis platform plasma cleaning machine adopts customizable moving rails and zero-potential direct injection plasma guns. Atmospheric direct-injection plasma treatment solves poor bonding, printing and coating defects for tiny precision electronic parts, perfectly matching mass production lines for semiconductors, PCB, FPC, automotive electronics and new energy industries.
Product Features
1. Adopts military-grade hardware design, with an operating ambient temperature range of -25°C to 50°C, adapting to various harsh working scenarios. Its MTBF (Mean Time Between Failures) reaches ≥190,000 hours under the MIL-HDBK-217F standard (at 25°C).
2. Digital control, digital display, real-time monitoring and strong anti-interference performance.
3. Equipped with functions including air pressure detection, mainboard temperature detection and power adjustment.
4. Integrated control with proprietary intelligent chip, supporting real-time monitoring with a response time less than 0.1s and outstanding anti-interference capability.
5. The plasma power factor is ≥79%, featuring high power factor, stable dynamic balance and high electrode discharge saturation.
6. Multi-layer protection functions are available, including over-temperature protection, overload protection, short-circuit protection, open-circuit protection, leakage protection and protection against various misoperations.
Equipment Structure
The atmospheric direct-spray plasma surface treatment system mainly consists of a power generator, plasma generating spray gun and control system.
1. Power Generator
It supports automatic power matching to deliver stable, high-precision power output. The output power remains unaffected by air pressure fluctuations. Parameters can be adjusted according to actual workpiece conditions to achieve optimal treatment results.
2. Direct-Injection Plasma Spray Gun
It is mainly used for processing small-area and irregularly shaped materials, with an effective treatment width ranging from 2mm to 6mm. It can be matched with existing production lines to realize fully automatic inline production and cut labor costs.
3. Control System
The control system is integrated inside the main unit of the power generator. It governs the operation of the atmospheric plasma cleaner and provides overall system protection.
Plasma Generator DimensionsMain Unit Outline Dimension Drawing
Plasma Gun Dimensions
Outline Drawing of Plasma Gun
Technical Specifications: Atmospheric Plasma Generator Main Unit
1. Atmospheric Plasma Generator
(1) Main Unit Parameters
| Item | Specification |
| Model | HY-TM500 |
| Overall Dimension | 479*200*325mm (LWH) |
| Weight | 10KG |
| Input Power Supply | AC220V |
| Power Frequency | 25KHZ |
| Plasma Output Power | 0–800W, stepless adjustable with digital display |
| Control Mode | IO-linked automatic control / manual control |
| Protection & Alarm | Built-in protection functions for temperature, air pressure, overload, electric leakage, short circuit and open circuit |
| Detection Functions | Real-time monitoring of air pressure, output power and mainboard temperature |
(2) Atmospheric Direct-Spray Plasma Gun Specifications
| Item | Specification |
| Spray Gun Dimension | 228mm*75mm |
| Standard Nozzle Sizes | 2mm, 4mm, 6mm, 8mm |
| Plasma Cleaning Height | 3–20mm adjustable |
| Effective Plasma Treatment Width | 1–8mm |
| Operating Air Pressure | Standard 0.2Mpa, adjustable within 0.08–0.25Mpa |
2. Factory Installation Requirements
| Item | Details |
| Hazard Label | High-voltage hazard warning label |
| Operating Environment | Temperature: 15~35℃ |
| Humidity: 30~80% | |
| Other Precautions | Keep away from flammable gas, corrosive gas, explosive and reactive dust |
Product Details
HY-TM500 features customizable programmable XYZ 3-axis rails for precision spot processing of tiny irregular parts. Its narrow direct-injection gun outputs concentrated plasma with 1–8mm effective width. Rotary units only handle large flat substrates with dispersed plasma, while this model accurately treats deep grooves, micro holes and bonding edges unreachable by rotary spray guns
Interchangeable 2/4/6/8mm nozzles offer 1–8mm treatment width and 3–20mm adjustable working height. It targets micro PCB, FPC gold fingers, mini semiconductors and camera module edges with grooves or micro holes for localized activation & cleaning.
Multi-layer protection covers over-temperature, overload, short-circuit, leakage and misoperation. Digital sound-light alarms activate for abnormal air pressure or power to reduce unplanned production line downtime.
HY-AD03 is an atmospheric direct plasma cleaning device designed for surface cleaning, activation and modification under ambient air conditions. It features concentrated energy with a small treatment footprint, which effectively improves product adhesion, hydrophilicity and printability. It can also remove contaminants such as organic residues, oil stains and oxide layers from material surfaces.
HY-DC1000 is equipped with a wide coverage rotary gun and interchangeable nozzles ranging from 20 to 80mm, customized for large flat workpieces including full-size PCBs, new energy battery electrodes, automotive plastic components and display glass panels. It supports 0–1000W wide-range adjustable power to form uniform plasma coverage over large surfaces, efficiently stripping organic contaminants and eliminating printing voids & coating delamination issues for mass-production inline assembly lines.
HY-DD600 adopts narrow small nozzle design (2–6mm effective width), dedicated for tiny precision sensitive parts including chips, FPC flexible circuits, miniature BGA substrates. Zero-potential low-temperature plasma jet eliminates thermal burn risk for ultra-thin PI/ITO materials. Its compact gun fits narrow gaps and complex micro-structures, perfectly matching small automatic bonding & dispensing lines for semiconductor packaging and camera module pretreatment.
HY-AC500 adopts rotary plasma spray gun and dual manual & I/O control modes, realizing uniform cleaning, activation and micro-etching for PCB, FPC, BGA and semiconductor chips. It features military-grade hardware, digital real-time monitoring and multi-layer safety protection. This desktop 1000W analog plasma machine is widely used for pre-treatment in semiconductor packaging, 3C electronics, display, automotive electronics and new energy industries.
HY-AC1000H uses vacuum-free low-temperature neutral plasma, fitted with customizable rails and dual rotary guns. With 0–1000W adjustable power and 20–80mm treatment width, it safely cleans chips without thermal damage. Combined physical & chemical dry cleaning enhances bonding for die attach, wire bonding and molding to reduce delamination and voids. Supporting manual & IO control with full safety monitoring, it connects to auto lines for continuous processing of substrates, lead frames and large FPC panels, delivering stable long-hour full-load production with response time below 0.1s.
HY-AS1200 is fitted with a motor-driven rotating nozzle to create an even plasma surface. With a treatment width of 20–80 mm and adjustable power ranging from 0 to 1200 W, it perfectly matches batch pre-treatment of large-area lead frames and substrates. The room-temperature neutral plasma will not damage chips, dry removing organic residues and surface oxides under atmospheric pressure to strengthen adhesion for die attach, wire bonding and molding while cutting delamination and void defects. Equipped with multi-layer safety protection and fully compatible with automated production lines, this equipment is widely used in packaging and testing procedures for ICs, FPCs and automotive chips.
HY-AD800 safely processes delicate chips, PCBs and plastic components without thermal deformation. Equipped with 0–800W adjustable power, IO/manual dual operation and complete safety protection, it can be easily integrated into automated production lines for surface cleaning, activation and improved bonding, making it ideal for semiconductor packaging, 3C electronics, automotive, new energy and LED manufacturing.
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