What Are You Looking For?
HY-ED010 Die Bonding Machine is a Die bonding machine developed for Automotive LED and Optoelectronic Semiconductor Packaging applications.
Brand :
HYRNUSItem No. :
HY-ED010Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaEutectic Bonder for Automotive LED and Optoelectronic Semiconductor
Product Introduction
HY-ED010 Eutectic Bonder With high-precision eutectic bonding technology and a comprehensive temperature control system as its core advantages, the equipment is widely used in automotive-grade packaging scenarios that demand stringent reliability and thermal performance, including Interior LED Components (LCD backlighting, automotive interior lighting, general applications) and Exterior LED Components (daytime running lights, fog lights, reverse lights, high/low beam headlights).
Application Scenarios
In-vehicle LED components: LCD backlighting, automotive interior, general applications
Exterior LED components: daytime running lights (DRL), fog lights, reverse lights, high/low beam headlights
Product Feature
High-precision automatic chip angle correction system
Automatic PCB (substrate) change
Automatic wafer ring change (optional function)
Nozzle heating function: constant temperature up to 330°C
Workholder / substrate constant temperature heating function: constant temperature up to 285°C
Pre-heating and post-heating stage functions
Anti-float image system function
Missing die detection function
Nozzle clogging detection
Linear bond head for high eutectic bonding accuracy
Pre-eutectic inspection: checks for debris or serious defects on PCB
Post-bond inspection: checks chip placement and angle
Supports 6-inch and smaller wafer rings (other sizes customizable)
Power-off anti-collision protection function (new technology, no UPS required)
Multiple configurations available to meet different market demands; customizable according to requirements
Technical Specifications
| No | Category | Parameter | Specification |
| 1. General Information | Operating System | Windows 7 | |
| Supported Languages | Chinese / English | ||
| UPH | 5000 PCS/H (depends on eutectic process time and customer product process) | ||
| 2. Precision | X/Y Die Bonding Accuracy | ±10 μm (excluding photomask and raw material errors) | |
| Positioning Accuracy | ±7 μm (photomask) | ||
| Angle Accuracy | ±1° | ||
| Bond Head Type | Linear high-precision die bonding head | ||
| 3. Temperature Control | Die Bonding Stage Temperature | 285°C (±5°C) | |
| Bond Head Temperature | 330°C (±5°C) | ||
| 4. Automation (Optional) | Automatic PCB Change | Yes | |
| Automatic Wafer Ring Change | Optional | ||
| 5. Vision System | Camera Resolution | 1280 × 1024 pixels | |
| Inspection Functions | High-intelligence vision system, supports automatic inspection of shape, position, and post-bond inspection | ||
| 6. Compatibility | System Compatibility | Supports multiple map formats | |
| Customization | High openness, customizable according to different customer requirements | ||
| 7. Dimensions & Materials | PCB Size (W×L, max) | 110 mm × 130 mm | |
| Wafer Ring Size | 6 inch (other sizes customizable) | ||
| Die Size | 6 mil × 6 mil ~ 100 mil × 100 mil | ||
| Equipment Dimensions (L×W×H) | 1500 × 1350 × 1600 mm | ||
| Equipment Weight | 1050 kg (final weight subject to actual product) | ||
| 8. Utilities | Compressed Air | 5–6 kgf/cm² | |
Product Deatils
HY-ED022 Die Bonder is developed for Optical Communication and Optical Device Packaging applications.
HY-ED007 Die Attach Machine is a High-Precision Die attach machine developed for Optical Communication, Optical Modules, Multi-Chip Modules (MCM), 3D Packaging, and Optoelectronic Device applications.
HY-ED003 Die Attach Equipment is a High-Precision Eutectic Bonder developed for Optical Communication, Optical Modules, Multi-Chip Modules (MCM), 3D Packaging, and Optoelectronic Device applications.
HY-DB504 Die Bonder is a Fully Automatic Die Bonder developed for Ultra-High-Precision Optoelectronic and Semiconductor Packaging applications.
HY-DB503 Die Bonder is a High-Speed Fully Automatic Die Bonder developed for Optoelectronic and Semiconductor Packaging applications.
HY-DB501 Die Bonder is a fully automatic die bonder developed for ultra-high-precision optoelectronic and semiconductor packaging applications.It delivers precision-driven die attachment for optoelectronic packaging, targeting TO‑series devices, photodiodes, lasers, optocouplers, and miniLEDs with placement accuracy of ±5 μm and angular control within ±1°.
HY-DB500 Die Bonder is a high-end, fully automatic die bonder engineered for optoelectronic devices and high-precision semiconductor packaging. Built with exceptional stability, intelligent control, and a modular architecture, it is ideally suited for high-volume production of TO-series devices, photodiodes, lasers, optocouplers, miniLEDs, and consumer optoelectronic components.
leave a message
Scan To Wechat :
Scan To WhatsApp :
