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HY-ED003 Die Attach Equipment is a High-Precision Eutectic Bonder developed for Optical Communication, Optical Modules, Multi-Chip Modules (MCM), 3D Packaging, and Optoelectronic Device applications.
Brand :
HYRNUSItem No. :
HY-ED003Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaHigh Performance Eutectic Bonder for Semiconductor
Product Introduction
HY-ED003 Eutectic Bonder is a High-Precision Eutectic Bonder developed for Optical Communication, Optical Modules, Multi-Chip Modules (MCM), 3D Packaging, and Optoelectronic Device applications. With high-precision eutectic bonding technology as its core advantage, the equipment is widely used in high-end packaging scenarios such as optical communication modules and laser devices that demand stringent placement reliability and thermal management.
Application Scenarios
Optical communication and optical modules
Multi-Chip Module (MCM) and 3D Packaging
Optoelectronic and Laser Devices
Product Feature
This high-precision die bonding system features a linear bond head with multi-nozzle function, an angle calibration platform with dual-station configuration, and a high-precision automatic chip angle correction system. The pulse heating system enables fast heating and cooling, while the eutectic stage offers XY-axis automatic adjustment and calibration. The wafer stage supports dual wafer rings on each side with ejector pins for lift and switch between rings. High-precision ironless linear motors are used across the calibration stage, eutectic stage, and bond head transfer stage for superior motion control. Quality assurance is ensured through missing die detection, nozzle clogging detection, pre-eutectic inspection for debris or serious defects, and post-bond inspection for placement and angle verification. The system supports 6-inch and smaller wafer rings, is compatible with 2-inch and 4-inch waffle trays (other sizes customizable), and incorporates power-off anti-collision protection without requiring UPS.
Technical Specifications
| No | Category | Parameter | Specification |
| 1. General Information | Operating System | Windows 7 | |
| Supported Languages | Chinese / English | ||
| UPH | 300 PCS/H (depends on eutectic process time and customer product process) | ||
| 2. Precision | X/Y Die Bonding Accuracy | ±5 μm (excluding photomask and raw material errors) | |
| Angle Accuracy | ±0.5° | ||
| Bond Head Type | Linear high-precision die bonding head | ||
| 3. Speed | Single Cycle Time (3 chip) | 36 seconds | |
| 4. Vision System | Camera Resolution | 1280 × 1024 pixels | |
| Inspection Functions | High-intelligence vision system, supports automatic inspection of shape, position, and post-bond inspection | ||
| 5. Compatibility | System Compatibility | Supports multiple map formats | |
| Customization | High openness, customizable according to different customer requirements | ||
| 6. Dimensions & Weight | Wafer Ring Size | 6 inch (compatible with 2" and 4" waffle trays; other sizes customizable) | |
| Die Size | 6 mil × 6 mil ~ 100 mil × 100 mil | ||
| Equipment Dimensions (L×W×H) | 1700 × 900 × 1850 mm | ||
| Equipment Weight | 1600 kg (final weight subject to actual product) | ||
| 7. Utilities | Compressed Air | 5–6 kgf/cm² | |
Product Details
FAQs
The HY-ED003 achieves a UPH of approximately 300 units per hour. Please note that actual throughput depends on the eutectic process time and specific customer product requirements.
The system delivers X/Y die bonding accuracy of ±5 μm (excluding photomask and raw material errors) and angle accuracy of ±0.5°, ensuring high-precision placement for optical, optoelectronic, and MCM packaging applications.
The high-intelligence vision system supports automatic shape and position inspection, as well as post-bond inspection. Additional quality checks include pre-eutectic inspection for debris or serious defects, missing die detection, and nozzle clogging detection.
The system supports 6-inch and smaller wafer rings, and is compatible with 2-inch and 4-inch waffle trays. Other sizes are also customizable. The linear bond head with multi-nozzle function and dual-station angle calibration platform provide flexibility for various packaging requirements.
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