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HY-ED022 Die Bonder is developed for Optical Communication and Optical Device Packaging applications.
Brand :
HYRNUSItem No. :
HY-ED022Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaHigh-Precision Eutectic Bonding for Optical Communication
Product Introduction
HY-ED022 Eutectic Bonder With high-precision eutectic bonding technology and a dual-station eutectic heating system as its core advantages, the equipment is widely used in optical communication packaging scenarios that demand high placement accuracy and production efficiency, including Transmitting Optical Devices (access networks, wireless networks, transmission networks, data centers), Receiving Optical Devices (access networks, wireless networks, transmission networks, data centers), and Optical Modules.
Application Scenarios
Transmitting Optical Devices: Access networks, wireless networks, transmission networks, data centers
Receiving Optical Devices: Access networks, wireless networks, transmission networks, data centers
Optical module
Product Feature
High-precision automatic chip angle correction system
Automatic loading/unloading function (optional)
Eutectic heating system (±10°C)
Eutectic stage XY-axis automatic adjustment function
Dual-station eutectic heating stage for improved equipment efficiency
Missing die detection
Nozzle clogging detection
Observation inspection microscope / lens tube
90° flip feeding function
Linear dual-bond-head design for high die bonding accuracy
Pre-eutectic inspection: checks for debris or serious defects on TO6 material
Post-bond inspection: checks die placement and angle
Supports 6-inch and smaller wafer rings (other sizes customizable)
Power-off anti-collision protection function (new technology, no UPS required)
Multiple configurations available to meet different market demands; customizable according to requirements
Technical Specifications
| No | Category | Parameter | Specification |
| 1. General Information | Operating System | Windows 7 | |
| Supported Languages | Chinese / English | ||
| UPH | 1000 PCS/H (depends on eutectic process time and customer product process) | ||
| 2. Precision | X/Y Die Bonding Accuracy | ±10 μm (excluding photomask and raw material errors) | |
| Angle Accuracy | ±1° | ||
| Bond Head Type | Linear high-precision die bonding head | ||
| 3. Automation | Automatic Loading/Unloading | Yes | |
| 4. Vision System | Camera Resolution | 1280 × 1024 pixels | |
| Inspection Functions | High-intelligence vision system, supports automatic inspection of shape, position, and post-bond inspection | ||
| 5. Compatibility | System Compatibility | Supports multiple map formats | |
| Customization | High openness, customizable according to different customer requirements | ||
| 6. Material Types | TO56, TO38, TO9, etc. (requires changeover) | ||
| 7. Dimensions & Weight | Wafer Ring Size | 6 inch (other sizes customizable) | |
| Die Size | 6 mil × 6 mil ~ 100 mil × 100 mil | ||
| Equipment Dimensions (L×W×H) | 1600 × 1245 × 1850 mm | ||
| Equipment Weight | 1600 kg (final weight subject to actual product) | ||
| 8. Utilities | Compressed Air | 5–6 kgf/cm² | |
Product Deatils
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