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HY-DB503 Die Bonder is a High-Speed Fully Automatic Die Bonder developed for Optoelectronic and Semiconductor Packaging applications.
Brand :
HYRNUSItem No. :
HY-DB503Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaHigh-Speed Die Bonder for Optoelectronic And Semiconductor
Product Introduction
HY-DB503 Die Bonding machine supports 10‑inch wafer rings and handles die sizes spanning 6×6 mil to 100×100 mil on PCBs up to 90×280 mm. UV curing is optionally available for rapid adhesive stabilization. Housed in a compact 1350×1280×1650 mm frame weighing 1200 kg, this system delivers high‑density output with straightforward maintenance access. Windows 7 operation with English/Chinese language selection, combined with open customization parameters, enables rapid recipe changeover and seamless integration into existing production environments for scaling optoelectronic assembly capacity.
Application Scenarios
TO series devices, photodiodes, lasers, optocouplers, miniLEDs, consumer electronics optoelectronic devices, etc.
Product Feature
High-precision automatic chip angle correction system
Automatic PCB change (single or dual magazine configuration available)
Automatic wafer ring change (optional)
Constant-temperature dispensing function
Missing die detection
Nozzle clogging detection
Pre-dispensing inspection: checks for debris or serious defects on PCB
Glue amount detection: checks glue volume and presence
Post-bond inspection: checks die placement and angle
Supports 10-inch and smaller wafer rings (other sizes customizable)
UV PCB curing & UV fast curing function (optional)
Power-off anti-collision protection function (new technology, no UPS required)
Multiple configurations available to meet different market demands; customizable according to requirements
Technical Specifications
| No | Category | Parameter | Specification |
| 1. General Information | Equipment Name | HY-DB503 | |
| Operating System | Windows 7 | ||
| Supported Languages | Chinese / English | ||
| UPH | 15K/H (Max) (excluding photomask and raw material errors) | ||
| 2. Precision | X/Y Die Bonding Accuracy | ±15 μm | |
| Angle Accuracy | ±1° | ||
| 3. Speed | Single Chip Cycle Time | 240 ms (Max) | |
| 4. Vision System | Camera Resolution | 1280 × 1024 pixels | |
| Inspection Functions | High-intelligence vision system, supports automatic inspection of glue volume, shape, position, and post-bond inspection | ||
| 5. Automation | Automatic PCB Change | Yes | |
| Automatic Wafer Ring Change | Optional | ||
| 6. Compatibility | System Compatibility | Supports multiple map formats | |
| Customization | High openness, customizable according to different customer requirements | ||
| 7. Dimensions & Weight | PCB Size (W×L, max) | 90 mm × 280 mm | |
| Die Size | 6 mil × 6 mil ~ 100 mil × 100 mil | ||
| Wafer Ring Size | 10 inch (other sizes customizable) | ||
| Equipment Dimensions (L×W×H) | 1350 × 1280 × 1650 mm | ||
| Equipment Weight | 1200 kg (final weight subject to actual product) | ||
| 8. Utilities | Compressed Air | 5–6 kgf/cm² | |
Product Details
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HY-DB504 Die Bonder is a Fully Automatic Die Bonder developed for Ultra-High-Precision Optoelectronic and Semiconductor Packaging applications.
HY-DB501 Die Bonder is a fully automatic die bonder developed for ultra-high-precision optoelectronic and semiconductor packaging applications.It delivers precision-driven die attachment for optoelectronic packaging, targeting TO‑series devices, photodiodes, lasers, optocouplers, and miniLEDs with placement accuracy of ±5 μm and angular control within ±1°.
HY-DB500 Die Bonder is a high-end, fully automatic die bonder engineered for optoelectronic devices and high-precision semiconductor packaging. Built with exceptional stability, intelligent control, and a modular architecture, it is ideally suited for high-volume production of TO-series devices, photodiodes, lasers, optocouplers, miniLEDs, and consumer optoelectronic components.
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