Fully Automatic Die Bonder for Ultra-High-Precision Optoelectronic

HY-DB501 Die Bonding machine with extreme accuracy as its core advantage, the equipment is widely used in TO-series devices, photodiodes, lasers, optocouplers, miniLEDs, and consumer optoelectronic devices, making it particularly suitable for high-volume production of high-end products that demand stringent placement accuracy.Dual in‑line bond head architecture maintains stability across continuous operation, while the intelligent vision engine conducts three inspection checkpoints—pre‑dispensing surface verification, glue quantity and profile validation, and post‑bond alignment auditing—to intercept defects before they compromise assembly integrity. Automatic PCB exchange supports both single and dual magazine layouts, sustaining material flow without operator reloading. The system accommodates 6‑inch wafer rings and PCBs sized 90×280 mm, with optional UV curing and automatic wafer ring change expanding process coverage. Innovative power‑off collision prevention operates independently of UPS, lowering auxiliary equipment costs while protecting tooling during outages. Built on Windows 7 with bilingual interface support, the HY-DB501 offers parametric configurability for diverse die sizes from 6×6 mil to 100×100 mil. 

TO series devices, photodiodes, lasers, optocouplers, miniLEDs, consumer electronics optoelectronic devices, etc

Product Feature

This high-precision automatic die bonding system features automatic chip angle correction, automatic PCB change (single or dual magazine), and constant-temperature dispensing. Quality assurance is ensured through missing die detection, nozzle clogging detection, pre-dispensing inspection, glue amount detection, and post-bond inspection, with a dual in-line bond head delivering high bonding accuracy. It supports 6-inch and smaller wafer rings (other sizes customizable), optional UV PCB curing, and power-off anti-collision protection without UPS. Multiple configurations and full customization are available.

Technical Specifications

No	Category	Parameter	Specification
1. General Information		Equipment Name	HY-DB501
		Operating System	Windows 7
		Supported Languages	Chinese / English
		UPH	2K/H (Max) (varies depending on material and quality requirements)
2. Precision		X/Y Die Bonding Accuracy	±5 μm (excluding photomask and raw material errors)
		Angle Accuracy	±1°
3. Vision System		Camera Resolution	1280 × 1024 pixels
		Inspection Functions	High-intelligence vision system, supports automatic inspection of glue volume, shape, position, and post-bond inspection
4. Automation		Automatic PCB Change	Yes
		Automatic Wafer Ring Change	Optional
5. Compatibility		System Compatibility	Supports multiple map formats
		Customization	High openness, customizable according to different customer requirements
6. Dimensions & Weight		PCB Size (W×L, max)	90 mm × 280 mm
		Die Size	6 mil × 6 mil ~ 100 mil × 100 mil
		Wafer Ring Size	6 inch (other sizes customizable)
		Equipment Dimensions (L×W×H)	1600 × 1000 × 1630 mm
		Equipment Weight	1050 kg (final weight subject to actual product)
7. Utilities		Compressed Air	5–6 kgf/cm²

Product  Details

FAQs

What is the maximum UPH the HY-DB501 can achieve?

The HY-DB501 achieves a maximum UPH of 2,000 units per hour. Please note that actual throughput may vary depending on material characteristics and specific quality requirements.

What is the die bonding accuracy of this system?

The system delivers X/Y die bonding accuracy of ±5 μm (excluding photomask and raw material errors) and angle accuracy of ±1°, ensuring high-precision placement for optoelectronic and semiconductor devices.

What types of inspection does the vision system support?

The high-intelligence vision system supports pre-dispensing inspection, glue amount and shape detection, glue position verification, and post-bond inspection, providing comprehensive quality assurance throughout the bonding process.

Can the system be customized for different production requirements? 

the system offers high openness with multiple configurations available. It supports 6-inch wafer rings (other sizes customizable), automatic PCB change with single or dual magazine options, automatic wafer ring change (optional), and UV PCB curing function (optional). Customization is available to meet specific customer needs.