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HY-ED007 Die Attach Machine is a High-Precision Die attach machine developed for Optical Communication, Optical Modules, Multi-Chip Modules (MCM), 3D Packaging, and Optoelectronic Device applications.
Brand :
HYRNUSItem No. :
HY-ED007Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaUltra-High-Precision Eutectic Bonder for Optoelectronic Device
Product Introduction
HY-ED007 Eutectic Bonder With ultra-high-precision eutectic bonding technology as its core advantage, the equipment is widely used in high-end packaging scenarios such as optical communication modules and laser devices that demand the highest levels of placement accuracy, reliability, and thermal management.
Application Scenarios
Optical communication and optical modules
Multi-Chip Module (MCM) and 3D Packaging
Optoelectronic and Laser Devices
Product Features
Linear bond head with multi-nozzle function
Angle calibration platform with dual-station configuration
High-precision automatic chip angle correction system
Pulse heating system (fast heating and cooling capability)
Eutectic stage XY-axis automatic adjustment and calibration function
Dual wafer rings on each side of the wafer stage, with ejector pins that can lift and switch between wafer rings
Calibration stage, eutectic stage, and bond head transfer stage use high-precision ironless linear motors
Technical specifications
| No | Category | Parameter | Specification |
| 1. General Information | Operating System | Windows 7 | |
| Supported Languages | Chinese / English | ||
| UPH | 300 PCS/H (depends on eutectic process time and customer product process) | ||
| 2. Precision | X/Y Die Bonding Accuracy | ±3 μm (excluding photomask and raw material errors) | |
| Angle Accuracy | ±0.3° | ||
| Bond Head Type | Linear high-precision die bonding head | ||
| 3. Speed | Single Cycle Time (3 chip) | 36 seconds | |
| 4. Vision System | Camera Resolution | 1280 × 1024 pixels | |
| Inspection Functions | High-intelligence vision system, supports automatic inspection of shape, position, and post-bond inspection | ||
| 5. Compatibility | System Compatibility | Supports multiple map formats | |
| Customization | High openness, customizable according to different customer requirements | ||
| 6. Dimensions & Weight | Wafer Ring Size | 6 inch (compatible with 2" and 4" waffle trays; other sizes customizable) | |
| Die Size | 3 mil × 3 mil ~ 100 mil × 100 mil | ||
| Equipment Dimensions (L×W×H) | 1840x1400x1880mm | ||
| Equipment Weight | 1600 kg (final weight subject to actual product) | ||
| 7. Utilities | Compressed Air | 5–6 kgf/cm² | |
Product Details
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