What Are You Looking For?
HY-VI8 Vacuum Soldering Furnace is a fully automatic inline vacuum soldering furnace specially optimized for lead frame products and power devices in the semiconductor industry, supporting PDFN, QFN, SMA, TO220, and TO3P packages.
Brand :
HYRNUSItem No. :
HY-VI8Order(MOQ) :
1 SetWarranty :
One-Year Warranty and Lifetime MaintenancePayment :
T/TLead Time :
7-35 DaysProduct Origin :
ChinaFully Automatic Inline Vacuum Soldering Furnace for Power Devices SMT
Product Introduction
HY-VI8 Solder Paste Inspection features a dual vacuum chamber design with an original Bosch vacuum pump from Germany, significantly reducing void rate to below 1% with proper solder paste. The system enables fully automatic loading and unloading without manual intervention, delivering high productivity with low energy consumption, low nitrogen usage, and a compact footprint of less than 3 meters in length. Equipped with 8 heating zones, 1 vacuum zone, and 2 cooling zones, it reaches a maximum temperature of 400°C with vacuum pressure of 1–12 Pa. Key technologies include a high-efficiency gas control system ensuring uniform distribution and ultra-low oxygen content, plus an advanced ionized flux recovery system with multi-stage separation for clean exhaust emission.
Structure
Key Technologies
German vacuum pump ensures stable vacuum performance
Advanced design ensures uniform gas distribution and ultra-low oxygen content
High-efficiency exhaust system minimizes flux residue and reduces cleaning frequency
Performance Comparison
Specifications
| Heating Zones | 8 |
| Vacuum Zone | 1 |
| Cooling Zones | 2 |
| Power Supply | 380 V |
| Start-up Power | 32.6 kW |
| Operating Power | 10.9 kW |
| Max. Temperature | 400 °C |
| Vacuum Pressure | 1–12 Pa |
Terms of Use
Temperature：Below 28°C
Humidity:30% – 70%
Cleanroom:Class 10,000 or better
Voltage:220V for all equipment except the vacuum reflow oven (380V)
Product Details
HY-TP700 Precision AB Glue Dispenser is designed for accurate A/B glue proportioning, mixing and quantitative dispensing. With an industrial PC, advanced motion control system and high-precision three-axis robotic arm, it delivers stable and efficient dispensing performance for PCB, electronic components, automotive accessories, lighting products and other applications.
HY-CUS03 Automatic Push-Pull Glue Dispensing and Sorting System is an automatic push-pull glue dispensing and sorting system specifically designed for SMA, SMB, and SMC package products.
HY-PU001 Sealant Dispensing Machine processing machine is an automatic push-pull glue dispensing and sorting system specifically designed for TO252-6R package products.
HY-PU001A Epoxy Dispensing Machine is an automatic push-pull glue dispensing and sorting system specifically designed for TO220 package products.
HY-PM400 Fully Automatic Vacuum Potting Machine combines vacuum degassing, precision metering, dynamic mixing, three-axis dispensing and automatic cleaning. It automatically dispenses two-component adhesives under adjustable vacuum conditions to reduce bubbles and voids, making it suitable for automotive electronics, capacitors, coils, transformers, relays and power modules.
HY-TP3030 Automatic Two-component Potting Machine combines a precision metering system with a high-accuracy three-axis motion platform to automatically meter, mix and dispense two-component adhesives. With vacuum feeding and degassing functions, it is suitable for automatic dispensing, potting and sealing of various electronic products.
HY-PM3030 is an inline automatic two-component potting machine integrating conveyor transfer, precision metering, adhesive mixing and three-axis dispensing. It supports vacuum material feeding and degassing and can be connected with transfer conveyors, curing ovens and other automation equipment for potting, sealing and insulation of circuit boards, electronic components, automotive electronics, lighting products and small appliances.
leave a message
Scan To Wechat :
Scan To WhatsApp :
