Inline Automatic Two-Component Glue Potting Machine For Electronic Components

HY-PM3030 is an inline automatic two-component potting machine integrating conveyor transfer, precision metering, adhesive mixing and three-axis dispensing. It supports vacuum material feeding and degassing and can be connected with transfer conveyors, curing ovens and other automation equipment for potting, sealing and insulation of circuit boards, electronic components, automotive electronics, lighting products and small appliances.

Brand :
HYRNUS
Item No. :
HY-PM3030
Order(MOQ) :
1 Set
Warranty :
One-Year Warranty and Lifetime Maintenance
Payment :
T/T
Lead Time :
7-35 Days
Product Origin :
China

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Inline Automatic Two-Component Glue Potting Machine For Electronic Components

Product Introduction

HY-PM3030 Inline Automatic Two-Component Potting Machine is designed for continuous automated production. It integrates rail conveying, precision metering, automatic mixing, controlled dispensing and three-axis motion control into one system.

The machine uses an industrial computer and motion control card together with a high-precision three-axis robotic system to perform fast, stable and accurate three-dimensional dispensing according to programmed paths.

Its inline conveyor can be connected to transfer stations, curing ovens and other automation equipment, enabling continuous product conveying, positioning, potting and unloading. The machine is suitable for various two-component adhesives and can be used for potting, sealing, insulation and protection of electronic products.

Product Features

Industrial computer and motion control card provide stable and accurate system control.
High-precision three-axis robotic system enables fast and precise three-dimensional dispensing.
Inline rail conveyor supports connection with transfer stations, curing ovens and other automated equipment.
Precision metering motors ensure accurate adhesive ratio control, automatic mixing and controlled dispensing.
Mixing ratio accuracy and dispensing accuracy can both reach ±2%.
Effective working area of up to 500 × 500 × 100 mm per dispensing head.
Multiple mixing ratios and dispensing rates are available for different production requirements.
Suitable for adhesives with viscosities below 100,000 cP.
Vacuum material feeding and vacuum degassing help reduce bubbles in the adhesive.
Optional heating, stirring, automatic cleaning and pressure monitoring functions are available.
Servo motors and ball screws provide smooth movement and accurate positioning.
Windows-based control system with a user-friendly interface for program editing and parameter setting.
Compact machine structure suitable for continuous automated production lines.

Applicable Industries

*PCB and circuit board potting

*Electronic component potting

*Power module potting

*Controller and driver potting

*Automotive electronics potting

*LED and lighting product potting

*Small appliance control module potting

*Ignition device potting

*In-vehicle electronic product potting

*Vacuum cleaner electronic component potting

*Filter and filter element dispensing

*Sealing, insulation and protection of other electronic products

Technical Parameter

Item	Specification
Model	HY-PM3030
Machine Type	Inline automatic two-component potting machine
Effective Working Range per Head	500(X) × 500(Y) × 100(Z) mm
X-Y Axis Movement Speed	0–500 mm/s
Z Axis Movement Speed	0–200 mm/s
Mixing Ratio Accuracy	±2%
Dispensing Accuracy	±2%
Adjustable Mixing Ratio	100:100–100:20 or 100:20–100:10
Dispensing Rate	1–10 g/s, 5–20 g/s or 10–30 g/s, depending on configuration
Applicable Adhesive Viscosity	＜100,000 cP
Control System	Industrial computer, display and motion control card
Metering Method	Stepper motor with gear pump/screw pump, or servo motor with piston pump
Operating Mode	Fully automatic inline operation
Anti-Curing Time Setting	0–9999 s, adjustable
Transmission System	Servo motor and ball screw
Power Supply	AC 220 V
Machine Dimensions	1470(L) × 1850(W) × 2400(H) mm
Machine Weight	Approx. 650 kg
Operating Temperature	0–40°C
Operating Humidity	20%–90% RH

Product Details

Two-Part Adhesive Dispensing Machine

FAQs

What is the HY-PM3030 in-line two component potting machine used for?

The HY-PM3030 is used for automatic two-component adhesive dispensing and potting. It is suitable for PCB assemblies, electronic components, lighting products, small home appliances, igniters, automotive accessories, filters, vacuum cleaner parts, and other products that require sealing, insulation, or protection.

What types of adhesives can this machine handle?

This machine is suitable for various two-component adhesives, such as epoxy, silicone, polyurethane, and other AB potting materials. The final configuration should be selected according to adhesive viscosity, mixing ratio, curing characteristics, and production requirements.

Is this machine suitable for automatic production lines?

Yes. The HY-PM3030 is an in-line fully automatic potting machine. It uses a track / rail conveyor and can be connected with board loaders, unloaders, curing ovens, and other upstream or downstream equipment.

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