Push-Pull Glue Dispensing and Sorting System for TO220

The HY-PU001A delivers sorting speeds of ≥8 pieces per minute and glue dispensing speeds of ≥32 units per minute, making it a high-efficiency solution for TO220 device assembly. This dual-speed capability allows the system to simultaneously handle sorting and dispensing operations, maximizing overall throughput in semiconductor packaging lines.

The system is engineered for demanding production environments with MTBA (Mean Time Between Assistance) of ≥40 minutes, MTBF (Mean Time Between Failures) of ≥120 hours, and downtime rate of ≤3%. Mean Time To Resolve (MTTA) is ≤5 minutes, ensuring that any issues can be quickly addressed to minimize production interruptions and maintain line efficiency.

The HY-PU001A utilizes a push rod feeding method driven by a stepper motor for precise material advancement, while the pick-up section employs a linear module with servo motor for accurate component handling. The dispensing section features a vibratory bowl feeder with enclosed linear module and servo motor drive, ensuring consistent glue application. A negative pressure fan with 560W dust treatment capability maintains a clean working environment.

The system is controlled by a PLC with a 7-inch touch screen HMI, supporting both automatic and manual operation modes. The interface is available in Simplified Chinese with three-tier user permissions (Operator, Technician, Administrator). Parameterized position setting, initialization functions, and comprehensive documentation including circuit diagrams and maintenance