al wire bonding

The HY-WB700/HY-WB700P Fully Automatic Ball Wire Bonder is a standard planar wire bonding system designed for high-precision semiconductor packaging applications. It supports customizable rails, fixtures, and magazines. Equipped with dual-frequency transducer, auto-focus optical path, advanced motion control, and multi-stage EFO system, it ensures stable, efficient, and highly reliable bonding performance.

HY-HW300 Full-Automatic Heavy Wire Bonder is designed for chip interconnection in advanced electronic components, widely used in power modules for EVs, renewable energy, rail transit, medical and aerospace systems. It features real-time bonding deformation and ultrasonic energy monitoring, closed-loop loop control, non-destructive testing, and high-precision automatic calibration for stable and reliable performance.

HY-WB350PM / HY-WB350M Gold Wire Wedge Bonding Machine is designed for internal chip-to-pin interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, microwave, optoelectronic and automotive electronic devices. It supports products under 200 mm and provides stable ultrasonic output for reliable bonding performance.

HY-WB150M Gold Ribbon Bonding Machine is designed for internal chip-to-pin interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, microwave, optoelectronic and automotive electronic devices. It supports products under 200 mm and provides stable ultrasonic output for reliable and consistent bonding.

HY-WB450M / HY-WB450PM Copper Wire Bonding Equipment is designed for internal chip-to-pin interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, optoelectronic, microwave and automotive electronic devices. It supports products under 200 mm and provides stable ultrasonic output for reliable and consistent bonding.

HY-WB250M / HY-WB250PM Ball Wedge Bonding Machine is designed for internal wire interconnection in hybrid circuits, COB modules, MCMs, MEMS, RF, optoelectronic, microwave and automotive electronic devices. It supports products under 200 mm, accommodates different cavity depths and provides stable ultrasonic output for reliable bonding performance.

HY-RW4000 Precision Semiconductor Wire Re-bonding Machine is specialized machinery designed specifically for PCB (printed circuit board) manufacturers to re-bonding circuit boards.